Industry News | 2017-01-24 10:55:12.0
BP 256 is YINCAE’s new ball attach adhesive product
Industry News | 2015-11-18 13:15:58.0
Albany, NY – YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2015 Global Technology Award in the adhesives, coatings, and encapsulants category! This ceremony took place on Tuesday, November 10th at the Productronica Global Exhibition in Munich, Germany.
Industry News | 2016-03-03 08:45:28.0
Henkel Adhesive Technologies today announced an addition to its line of Bergquist Liqui-Form® Thermal Interface Materials (TIMs) with the market introduction of Liqui-Form 3500. A one-part, thermally conductive, liquid formable gel, Liqui-Form 3500 combines high thermal conductivity with process flexibility and excellent reliability.
Industry News | 2009-12-07 20:44:54.0
At the Productronica 2009 tradeshow in Munich, Finetech will introduce its upcoming entry-level rework system, the FINEPLACER® core.
Industry News | 2009-01-16 17:14:22.0
FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009
Industry News | 2014-06-30 14:25:43.0
YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.
Industry News | 2016-07-26 16:59:00.0
SMTA International is 2 months away!
Industry News | 2016-08-24 15:39:05.0
SMTA international is just a month away!
Industry News | 2009-12-07 20:18:12.0
We are pleased to announce the acquisition by Finetech GmbH & Co. KG, Berlin of MARTIN GmbH, Wessling near Munich. Finetech CEO, Gunter Kuerbis explains that the Martin products complement perfectly the range of systems successfully sold around the world under the flagship FINEPLACER® name. Additionally, MARTIN CEO, Bernhard Martin sees that the addition of dispenser technology, a core capability of his company, will provide a broader product offering range to Finetech’s already significant position in the Rework and Micro-assembly arena.
Industry News | 2016-04-07 09:09:16.0
Finetech/Martin will showcase three new dispense products and a new version of the Mini-Oven BGA/CSP reballing unit in Booth #1259 at the upcoming IPC APEX Conference scheduled for March 15-17, 2016 at the Las Vegas Convention Center.
