Industry News: reworkable edgebond adhesive (Page 8 of 17)

Process Sciences Announces "SMT Bootcamp" Training Course Schedule

Industry News | 2001-02-22 18:03:41.0

Process Sciences (PSI) has announced the schedule for upcoming "SMT Bootcamp" courses. These highly popular, 2 day intensive training courses provide in-depth, practical process understanding to persons interested in ensuring quality in electronic assemblies.

Process Sciences, Inc.

High Accuracy Die Bonder on display at Semicon West 2009

Industry News | 2009-06-23 19:41:14.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 712 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Ca.

Finetech

High Accuracy Die Bonder on Display at IMAPS 2009

Industry News | 2009-10-16 19:21:16.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 515 at the upcoming IMAPS 2009 exhibition, scheduled for November 3-5, 2009, at the San Jose Convention Center in San Jose, Calif.

Finetech

High Accuracy Die Bonder on Display at SPIE Photonics West 2010

Industry News | 2010-01-07 20:09:26.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 1026 at the upcoming SPIE Photonics West exhibition, scheduled for January 23-28, 2010 at the Moscone Center in San Francisco, CA.

Finetech

FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010

Industry News | 2010-06-23 12:33:29.0

FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

Finetech

FINETECH to Showcase Sub-Micron Bonder at IMAPS 2010

Industry News | 2010-10-04 16:32:22.0

FINETECH will showcase the FINEPLACER® Lambda in booth 706 at the upcoming IMAPS 2010 Exhibition, scheduled for November 2-4, 2010 at the Raleigh Convention Center - Research Triangle in Raleigh, NC.

Finetech

FINETECH to Showcase Sub-Micron Bonder at SPIE Photonics West 2011

Industry News | 2011-01-05 15:36:14.0

FINETECH will showcase the FINEPLACER® Lambda in Booth 2204 at the upcoming SPIE Photonics West exhibition, scheduled for January 22-27, 2011 at the Moscone Center in San Francisco.

Finetech

FINETECH to Showcase Sub-Micron Bonder at IMAPS Device Packaging 2011

Industry News | 2011-02-14 16:47:35.0

FINETECH will showcase the FINEPLACER® Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.

Finetech

FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach

Industry News | 2011-09-12 13:16:36.0

FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition

Finetech

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

Industry News | 2012-09-05 08:13:47.0

Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition

Finetech


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