Industry News: reworkable edgebond adhesive (Page 8 of 16)

Finetech to Acquire Martin GmbH, Munich

Industry News | 2009-12-07 20:18:12.0

We are pleased to announce the acquisition by Finetech GmbH & Co. KG, Berlin of MARTIN GmbH, Wessling near Munich. Finetech CEO, Gunter Kuerbis explains that the Martin products complement perfectly the range of systems successfully sold around the world under the flagship FINEPLACER® name. Additionally, MARTIN CEO, Bernhard Martin sees that the addition of dispenser technology, a core capability of his company, will provide a broader product offering range to Finetech’s already significant position in the Rework and Micro-assembly arena.

Finetech

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Industry News | 2016-04-07 09:09:16.0

Finetech/Martin will showcase three new dispense products and a new version of the Mini-Oven BGA/CSP reballing unit in Booth #1259 at the upcoming IPC APEX Conference scheduled for March 15-17, 2016 at the Las Vegas Convention Center.

Finetech

Process Sciences Announces "SMT Bootcamp" Training Course Schedule

Industry News | 2001-02-22 18:03:41.0

Process Sciences (PSI) has announced the schedule for upcoming "SMT Bootcamp" courses. These highly popular, 2 day intensive training courses provide in-depth, practical process understanding to persons interested in ensuring quality in electronic assemblies.

Process Sciences, Inc.

High Accuracy Die Bonder on display at Semicon West 2009

Industry News | 2009-06-23 19:41:14.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 712 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Ca.

Finetech

High Accuracy Die Bonder on Display at IMAPS 2009

Industry News | 2009-10-16 19:21:16.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 515 at the upcoming IMAPS 2009 exhibition, scheduled for November 3-5, 2009, at the San Jose Convention Center in San Jose, Calif.

Finetech

High Accuracy Die Bonder on Display at SPIE Photonics West 2010

Industry News | 2010-01-07 20:09:26.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 1026 at the upcoming SPIE Photonics West exhibition, scheduled for January 23-28, 2010 at the Moscone Center in San Francisco, CA.

Finetech

FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010

Industry News | 2010-06-23 12:33:29.0

FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

Finetech

FINETECH to Showcase Sub-Micron Bonder at IMAPS 2010

Industry News | 2010-10-04 16:32:22.0

FINETECH will showcase the FINEPLACER® Lambda in booth 706 at the upcoming IMAPS 2010 Exhibition, scheduled for November 2-4, 2010 at the Raleigh Convention Center - Research Triangle in Raleigh, NC.

Finetech

FINETECH to Showcase Sub-Micron Bonder at SPIE Photonics West 2011

Industry News | 2011-01-05 15:36:14.0

FINETECH will showcase the FINEPLACER® Lambda in Booth 2204 at the upcoming SPIE Photonics West exhibition, scheduled for January 22-27, 2011 at the Moscone Center in San Francisco.

Finetech


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