Industry News: reworkable edgebond adhesive (Page 10 of 17)

StenTech to Showcase Stencils & Tooling at the SMTA Silicon Valley Expo

Industry News | 2022-11-21 16:03:53.0

StenTech Inc. will showcase its new Advanced Nano Coating at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place Thursday, Dec. 8, 2022 in Sunnyvale, California. Additionally, the company will display its complete line of various stencils and tooling.

Stentech

StenTech Wins 2023 NPI Award for New Advanced Nano Coating

Industry News | 2023-01-30 16:10:55.0

StenTech® Inc. received a 2023 CIRCUITS ASSEMBLY NPI Award in the category of Screen/Stencil Printing Peripherals/Consumables for its new Advanced Nano Coating. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.

Stentech

StenTech to Discuss Advanced Nano Stencil Coating at the SMTA Wisconsin Expo

Industry News | 2023-05-15 17:48:55.0

StenTech® Inc. will exhibit at the SMTA Wisconsin Expo & Tech Forum, scheduled to take place Tuesday, May 16, 2023 at the Crowne Plaza Milwaukee Airport. Raza Khan, StenTech's Central Area Sales Manager, will be available to discuss the unique Advanced Nano Stencil technology.

Stentech

World's First Commercially Available Diamond Filled Underfill: SMT 158D8

Industry News | 2021-01-21 09:42:44.0

YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast-flowing, and an easy reworkable liquid epoxy.

YINCAE Advanced Materials, LLC.

FINEPLACER® matrix – "The new generation" World premiere at Productronica in Munich

Industry News | 2009-12-07 18:52:26.0

With the FINEPLACER® matrix, Finetech is not only extending its product range, but also pointing the way forward for the product family. The modular thinking behind the FINEPLACER ®s has been further perfected. Depending on the customer's requirements, the platform can be configured either as a high-end rework system or as a high-precision assembly and bonding system. In each case there are two accuracy options available, of 10 µm and 3 µm.

Finetech

Henkel develops materials innovations for high power electronics

Industry News | 2012-04-27 19:07:14.0

Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications. For the use of alternative energies, ultra-high efficiency and high-power density designs are imperative. Recognizing these market needs, Henkel has developed a comprehensive range of materials to further advance power electronics technology and will showcase these innovations from 8 to 10 May at SMT in Nuremberg.

Henkel Electronic Materials

NEPCON China 2008 - FINEPLACER�Lambda

Industry News | 2008-04-07 21:09:26.0

FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.

Finetech

OK International Launches “Take the Challenge” Initiative Innovative Solutions for Electronics and Industrial Assembly Challenges

Industry News | 2013-07-15 18:04:31.0

OK International today announced the launch of its “Take the Challenge” campaign.

OK International

SMT 88UH Fast Cure, Reworkable Underfill

Industry News | 2014-07-08 11:04:03.0

YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88UH. SMT 88UH is a new and groundbreaking underfill. It can be underfilled at room temperature without preheating a substrate.

YINCAE Advanced Materials, LLC.

IMAPS New England 2016

Industry News | 2016-04-08 14:12:30.0

IMAPS New England is 1 month away! VISIT YINCAE Booth Join Dr. Yin’s Presentation May 3rd, 1PM

YINCAE Advanced Materials, LLC.


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