Industry News: reworking bga (Page 10 of 42)

BEST Inc. Puts Semi-Automated Mass PCB Rework Process Online

Industry News | 2017-03-31 12:29:11.0

BEST installs and brings Up mass rework machine capability to reduce costs and increase the turnover of boards requiring lots of parts change outs.

BEST Inc.

BEST Releases 2nd Half Training Schedule for 2016

Industry News | 2016-05-25 18:26:38.0

BEST's 2nd half of 2016 schedule including more dates and classes in Detroit.

BEST Inc.

Custom SRT and Hot Air Nozzles

Industry News | 2019-05-12 15:58:00.0

Fast Shipment of Custom SRT Nozzles

BEST Inc.

Reballing Preforms Now in 3 Days

Industry News | 2013-09-03 11:52:21.0

BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects

BEST Inc.

ACD Adds a PDR IR-E3 Evolution 2000 BGA Rework System to Its Repertoire

Industry News | 2012-05-22 14:14:12.0

ACD,announced the purchase of a PDR IR-E3 Evolution 2000 BGA Rework System for ultimate performance in BGA rework.

Automated Circuit Design (ACD)

Seamark Zhuomao new factory opened at Central of China!

Industry News | 2019-04-09 06:24:39.0

Seamark Zhuomao new factory opened at 8th,April in Hubei province, central of China.

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

PDR Rework Welcomes Leo Gibbs as Commercial Director

Industry News | 2024-03-26 13:10:05.0

PDR Rework proudly announces the appointment of Leo Gibbs as the Commercial Director. In his new role, Gibbs will play a pivotal part in steering the company's commercial strategies, further solidifying PDR Rework's position as an industry leader in advanced rework solutions.

PDR Rework

Prices Slashed � Jovy Systems RE-7500 BGA Rework Station

Industry News | 2009-04-02 09:23:02.0

Economic woes � Chinese companies vie for increased sales

AVRepair, Inc.

Reworkable Underfill Encapsulant for BGA's

Industry News | 2004-04-27 15:19:57.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.

Zymet, Inc

AV REPAIR TO DISTRIBUTE JOVY SYSTEMS' RE-7500 BGA REWORK SYSTEM

Industry News | 2008-08-03 12:48:00.0

New Lead-free compatible, IR-based Unit Reworks all BGA components, including Plastic parts, PTH Sockets, SMD Connectors and Metal Shields

AVRepair, Inc.


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