Industry News: rf and absorber (Page 1 of 12)

XEMICS' New 433MHz and 868MHz ETSI/FCC Compliant RF Modules

Industry News | 2003-05-22 08:14:29.0

RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module

SMTnet

EMC Automotive Component Testing Detailed in Free Wall Chart from Schaffner EMC

Industry News | 2003-06-25 12:28:40.0

The chart includes a variety of diagrams, tables, and ratio charts for RF Emissions; Direct RF Power Injection; Bulk Current Injection (BCI); ESD and Transients; as well as TEM Cell and Stripline testing.

SMTnet

Electronics Workbench Announces Multisim 7 and Multicap 7 for Professional Circuit Engineers and Designers

Industry News | 2003-05-06 09:05:12.0

New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance

SMTnet

Electronics Workbench Taps Industry Talent as New Vice President of Sales and Marketing

Industry News | 2003-03-04 08:31:59.0

Ian Suttie To Drive Company's Expansion in Professional Printed Circuit Board Design Market

SMTnet

Shannan O’Shaughnessy, GVD Corporation, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24

Industry News | 2017-08-14 18:22:34.0

The SMTA Capital Chapter is pleased to announce that Shannan O’Shaughnessy of GVD Corporation, will present “Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.

Surface Mount Technology Association (SMTA)

PCB Design and Layout Guidelines

Industry News | 2018-10-18 11:15:12.0

PCB Design and Layout Guidelines

Flason Electronic Co.,limited

Electronic Components, Parts and Their Function

Industry News | 2018-12-08 03:22:25.0

Electronic Components, Parts and Their Function

Flason Electronic Co.,limited

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:17:09.0

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Flason Electronic Co.,limited

IPC Seeking Volunteers for 2003 Annual Meeting and Technical Conference

Industry News | 2003-04-17 11:32:31.0

Taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, Minn.

Association Connecting Electronics Industries (IPC)

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