Industry News: rf and absorber (Page 1 of 13)

XEMICS' New 433MHz and 868MHz ETSI/FCC Compliant RF Modules

Industry News | 2003-05-22 08:14:29.0

RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module

SMTnet

EMC Automotive Component Testing Detailed in Free Wall Chart from Schaffner EMC

Industry News | 2003-06-25 12:28:40.0

The chart includes a variety of diagrams, tables, and ratio charts for RF Emissions; Direct RF Power Injection; Bulk Current Injection (BCI); ESD and Transients; as well as TEM Cell and Stripline testing.

SMTnet

Electronics Workbench Announces Multisim 7 and Multicap 7 for Professional Circuit Engineers and Designers

Industry News | 2003-05-06 09:05:12.0

New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance

SMTnet

Electronics Workbench Taps Industry Talent as New Vice President of Sales and Marketing

Industry News | 2003-03-04 08:31:59.0

Ian Suttie To Drive Company's Expansion in Professional Printed Circuit Board Design Market

SMTnet

Shannan O’Shaughnessy, GVD Corporation, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24

Industry News | 2017-08-14 18:22:34.0

The SMTA Capital Chapter is pleased to announce that Shannan O’Shaughnessy of GVD Corporation, will present “Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.

Surface Mount Technology Association (SMTA)

Meet Clariant at IPC APEX EXPO for a one-to-one interview about the unique support for more sustainable electronics’ production and the J-STD-033D-preferred unique moisture-control combo for dry packe

Industry News | 2020-01-13 16:38:18.0

As electronics brands demand more sustainable materials and product reliability across their supply chains, Clariant brings two elements together to uniquely boost moisture-exposure assurance for dry-packed Level 2+ components. It is the only option for semiconductor manufacturers, integrated circuit companies and OEM suppliers to meet latest J-STD-033D preferences and increasing low-halogen & cobalt-dichloride-free specifications.

Clariant Cargo & Device Protection

Clariant Whitepaper on Performance and Sustainability of Bentonite Clay Desiccants in Moisture Controlled Packaging

Industry News | 2017-10-05 12:40:41.0

The new whitepaper highlights the specific benefits of bentonite clay in terms of composition, moisture-adsorption performance, production requirements, and the environmental impact of available moisture controlled packaging solutions.

Clariant Cargo & Device Protection

IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop

Industry News | 2023-05-15 17:38:25.0

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an "On-Shoring Advanced Packaging and Assembly," workshop July 10-12, 2023, in Washington, D.C.

Association Connecting Electronics Industries (IPC)

IPC Seeking Volunteers for 2003 Annual Meeting and Technical Conference

Industry News | 2003-04-17 11:32:31.0

Taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, Minn.

Association Connecting Electronics Industries (IPC)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

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