Industry News | 2021-03-06 03:11:18.0
Indium Corporation will feature the award-winning Durafuse™ LT–the novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications–during Productronica China, held March 17-19 inShanghai, China.
Industry News | 2022-06-16 18:16:43.0
Southwest Systems Technology, Inc. is pleased to announce that it now represents VJ Electronix, Inc. rework systems in the states of Texas, Oklahoma, Arkansas and Louisiana. VJ Electronix is the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems.
Industry News | 2018-09-06 15:18:14.0
Although many High Q capacitors are available on the market, performance can vary widely depending on design and quality of manufacturing
Industry News | 2018-10-18 11:15:12.0
PCB Design and Layout Guidelines
Industry News | 2021-05-21 12:12:03.0
Device Reduces Component Temperature by Over 25%, Enabling Higher Power Handling Capability or Longer Useful Life
Industry News | 2014-04-10 10:17:27.0
AI Technology has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power devices.
Industry News | 2014-01-29 14:44:32.0
Arrival Electronics introduces the FerriSSD® series from Silicon Motion. FerriSSD® is a fully integrated SATA/PATA Solid State Drive(SSD) in a single chip BGA package. Available in densities from 1GB to 64GB in a tiny 16x20mm BGA package, in both SLC and MLC flash along with Silicon Motion's own unique SLC mode technology, offering SLC level performance at MLC pricing.
Industry News | 2016-05-04 12:59:35.0
CAMI Research has issued its latest catalog featuring new products and services. Available immediately, the catalog showcases their expanding CableEye suite of Low and High Voltage (HiPot) test system products for cable & wire harness manufacturing.
Industry News | 2018-07-17 13:56:31.0
Tiny RF chip antennas are no longer relegated to PCB “keep out” area, allowing product designers to further miniaturize wireless biosensors and medical wearables
Industry News | 2019-11-05 22:20:35.0
8 Layer PCB Stack-up Guidelines How to improve EMC performance on 8 layer PCB design? The following text is reproduced, with permission, from Part 4 of a 6-Part article on PCB Stackup by Henry W. Ott. The original article is available at http://www.hottconsultants.com/tips.html
