Industry News | 2021-03-23 08:23:59.0
YXLON International presented the new release of the Cheetah and Cougar EVO microfocus X-ray families in three online events. Under the motto 'Innovation is key to Evolution - Evolution empowers you', the next step towards automation was demonstrated and new options were presented that significantly increase efficiency in the X-ray inspection of electronic components.
Industry News | 2021-11-24 20:05:40.0
1. Main Circuit Wiring 1.1 Open the cover by squeezing the grooves on both sides of the VFD(variable frequency drive), remove the wire baffle, connect the terminals R, S, T to the power, connect the terminals U, V, W to the motor, and connect the earth wire at the ground symbol. 1.2 Connect the yellow, green and red power cables to the R, S and T in sequence.
Industry News | 2019-08-21 02:23:08.0
The ultra-small temperature tracker BTT01 for cold chain have many features. It can be use in many filed,such cold chian ,supply chain management.
Industry News | 2021-09-14 02:08:49.0
In this article, I will talk about Top 10 Common Mistakes in PCB and PCBA Developing when makers/ startups/ engineers design a new electronics hardware products.
Industry News | 2013-05-21 21:02:10.0
The Large Hadron Collider (LHC) at the European Organisation for Nuclear Research, known as CERN, has come to the forefront of public attention recently with the discovery of the Higgs boson - the so called God’s particle. CERN operates a high energy collider 100m under the Swiss and French border near Geneva to explore the boundaries of high energy physics. It is high energy physics on a huge scale, matched by no other facility in the world.
Industry News | 2015-03-18 20:35:50.0
News reports claim that foreign companies are leaving China in numbers. So are major manufacturing operations, as evidenced by cases of Microsoft and Nokia, who both recently shut down their China plants. Uniqlo, Foxconn, Clarion and Samsung are also accelerating the transfer of their manufacturing activities to other countries. The made-in-China label is losing its au
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
