Industry News: root cause of no solder (Page 1 of 1)

FREE Download of Failures Analysis Booklet from ACI Technologies

Industry News | 2016-11-30 14:47:45.0

ACI Technologies invites you to download a free copy of its very popular e-booklet, “Failure Analysis Techniques for Electronics” from its Website store, which is located at http://store.aciusa.org/Failure-Analysis-Techniques-for-Electronics-Digital-Download-P181.aspx

ACI Technologies, Inc.

Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Industry News | 2013-11-01 16:09:44.0

Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter Presents “Enabling Implementation of Advanced Technologies” Tutorial Program on June 9th at ZESTRON Americas

Industry News | 2015-05-18 21:19:33.0

The SMTA Capital Chapter is pleased to announce it will welcome Denis Barbini, Universal Instruments Corporation, on June 9th to instruct a tutorial on Advanced SMT Technologies at ZESTRON Americas located at 11285 Assett Loop, Manassas, VA 20109. The tutorial is scheduled from 9:00 am to 4:30 pm and includes lunch. The following should attend: quality engineers, failure analysis engineers, reliability engineers, procurement specialists, design engineers, process engineers, project managers. Registration is required for this learning event.

Surface Mount Technology Association (SMTA)

LEADING EXPERTS TAKE TIN WHISKERS FROM THEORY TO PRACTICE AT IPC CONFERENCE Are we understating the use of tin whisker risk mitigation methodologies?

Industry News | 2012-03-26 15:58:58.0

Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.

Association Connecting Electronics Industries (IPC)

PCB Solder Finish Common Cause of Failure – Free Poster Guide

Industry News | 2010-08-02 05:25:55.0

Inspection and quality control colour posters to downlaod on PCB surface finishes

ASKbobwillis.com

Unlock the Future of Electronics Manufacturing: Gen3 and Zestron Workshop

Industry News | 2023-08-21 12:19:15.0

Gen3, a global leader in SIR (Surface Insulation Resistance), CAF (Conductive Anodic Filament), solderability, ionic contamination, and process optimization equipment, along with Zestron, renowned experts in cleaning and reliability solutions, are thrilled to announce an enlightening workshop focused on Electronics Manufacturing Processes: Where Quality Assurance Meets Surface Reliability. This informative seminar is scheduled to take place on Wednesday, September 6, 2023, at the Manufacturing Technology Centre in Ansty Park, Coventry.

Gen3 Systems

Datest Adds Akila XR-3 X-ray Inspection Capability to List of Offerings

Industry News | 2011-08-01 15:40:04.0

Datest recently added an Akila XR-3 X-ray inspection system from Christopher Associates to enhance its test service offerings. As Christopher Associates’ approved Demonstration Site for the XR-3, Datest will make its facility available for product demos and plant tours involving the XR-3.

Datest

Koh Young Technology Celebrates 15 Years of Success in Providing Total 3D Inspection Solutions

Industry News | 2017-05-30 20:05:30.0

3D inspection technology leader Koh Young Technology marked 15 years of continuous success in providing Total 3D inspection solutions to SMT/PCB assembly and other manufacturing industries. Koh Young celebrated its 15th Foundation Day on May 1, 2017. Established in 2002, Koh Young has led the industry in providing the world’s most advanced 3D measurement quality assurance solutions, including its market-leading Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems.

Koh Young America, Inc.

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