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SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2010-06-16 14:00:47.0

Minneapolis, MN - The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. The conference will be held at the Walt Disney World Swan and Dolphin Resort in Orlando, Florida on October 24-28, 2010. This year's program allows the attendee to choose from 20 courses, 130 technical papers, 4 focused symposia, and numerous free offerings throughout the conference.

Surface Mount Technology Association (SMTA)

Best Technical Papers at IPC APEX EXPO 2020 Selected

Industry News | 2020-01-20 16:42:42.0

The IPC APEX EXPO 2020 best technical conference papers in the domestic and international categories have been selected; the paper authors will receive their awards during the opening keynote session on Tuesday, February 4, 2020.

Association Connecting Electronics Industries (IPC)

High-Precision, High-Mix, Print-Place-Reflow Package Under $47K

Industry News | 2014-01-30 17:35:39.0

Manncorp has recently reconfigured and expanded its exclusive selection of SMT turnkey packages, including stencil printers, pick and place machines, and reflow ovens, to accommodate a wider range of production levels and budgets. Among the ten different turnkeys presented on their website at www.manncorp.com/turnkeys is the new 2500-MV package. Priced at only $46,995, the 2500-MV is designed for companies with a limited budget and minimal floor space who need short-run, in-house production capability for ultra-precise, high component-mix SMT assembly.

Manncorp

Multitest Announces Survey Drawing Winner

Industry News | 2013-03-21 12:34:55.0

Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, congratulates Mr. Rafael Reyes, the winner of its recent drawing. All survey participants were entered into a drawing for an iPad mini.

Multitest Elektronische Systeme GmbH

Full Probe Card Test

Industry News | 2021-07-15 03:55:39.0

The latest fixtureless technology available for production and validation testing the most challenging Probe Cards

SEICA SpA

FINE LINE STENCIL Introduces New Laser Technology

Industry News | 2008-06-03 15:08:51.0

COLORADO SPRINGS, CO � June 3, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces the availability of LPKF Laser Technology/SMT Stencil Laser Technology.

FCT ASSEMBLY, INC.

FCI Receptacles Take to Standard SMT Processes

Industry News | 2003-04-15 08:23:22.0

Metral TINT back panel receptacles are compatible with standard pin-in-paste SMT processes, eliminating costly secondary assembly operations including heat staking, wave soldering or press fitting.

FCI

FINE LINE STENCIL Stays at the Top of the Industry with Its Technical Support Services

Industry News | 2008-06-13 16:32:11.0

COLORADO SPRINGS, CO � June 12, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, believes that customer service is key to staying successful in today�s industry. It accomplishes this with the help of its Value Added Technical Support Team.

FCT ASSEMBLY, INC.

Universal Instruments’ APL Hosts AREA Consortium Meeting

Industry News | 2009-11-06 17:20:54.0

Universal Instruments’ Advanced Process Lab hosted the third 2009 Advanced Research in Electronics Assembly (AREA) Consortium meeting at the Treadway Inn in Owego, NY on October 28-29. More than 75 attendees from the 29 member companies participated in the two-day event and a much larger number has signed up for subsequent webcasts of the presentations. Topics ranged from lead-free solder microstructure and reliability to environmental stress screening procedures.

Universal Instruments Corporation

Universal Instruments’ APL Hosts Initial 2010 AREA Consortium Meeting

Industry News | 2010-07-29 15:10:06.0

Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.

Universal Instruments Corporation

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