Industry News | 2023-05-30 06:44:55.0
Hanwha Techwin Automation Americas is pleased to announce the promotion of Mark Choi to the role of Vice President of Sales for the United States and Canada, effective May 24th.
Industry News | 2013-02-08 23:26:44.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.
Industry News | 2013-05-03 16:44:07.0
Multitest,announces that James Quinn, VP of Sales & Marketing, will be a keynote speaker at the upcoming IPC Electronic System Technologies Conference & Exhibition (ESTC), scheduled to take place May 20-23, 2013 at The New Tropicana in Las Vegas, Nevada.
Industry News | 2016-05-16 20:04:24.0
Ryder Industries Ltd, the Swiss-owned EMS provider with manufacturing facilities in China, today released the results from its Clean Tech 2015. Ryder’s new plant in China saved: 1.3GWh of electricity (a nuclear power generation plant running at full power takes an hour to generate this) 1,500 tons of smog-gas (equivalent to a fleet of 75 twenty-ton shipping containers) 11,000 tons of water (that’s enough to fill four Olympic swimming pools)
Industry News | 2022-09-19 05:59:24.0
Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.
Industry News | 2023-09-25 20:04:34.0
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.
Industry News | 2022-08-14 14:12:26.0
Indium Corporation® is proud to feature its cutting-edge soldering and thermal materials at SEMICON Taiwan, September 14-16, in Taipei, Taiwan.
Industry News | 2023-08-29 07:11:55.0
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
| 1 |
