Industry News: sac 305 lead frame (Page 5 of 15)

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

Industry News | 2017-07-09 20:40:11.0

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

Shenmao Technology Inc.

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Low Residue Liquid Flux SMF-B51

Industry News | 2017-07-06 09:53:39.0

SHENMAO Technology introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.

Shenmao Technology Inc.

AIM to Showcase NC259 Solder Paste at IPC Midwest

Industry News | 2012-07-25 10:17:38.0

AIM, will highlight its new NC259 Solder Paste

AIM Solder

AIM to Highlight New NC259 Solder Paste at SMTA International 2012

Industry News | 2012-09-13 14:02:26.0

AIMannounces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo,

AIM Solder

EVS International Signs on Competitive Edge Solutions in New England

Industry News | 2022-04-13 10:26:25.0

EVS International is pleased to announce that it has signed on Competitive Edge Solutions, LLC as its newest manufacturers' representative. Dave Wilson, President, will represent EVS throughout the six New England states (MA, CT, RI, VT, NH, ME).

EVS International

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Industry News | 2017-08-10 17:43:56.0

Nihon Superior Co. announces its Nihon Superior Shanghai subsidiary will exhibit in Booth #1G08 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

Industry News | 2022-01-03 07:24:21.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI

Industry News | 2022-10-06 18:19:54.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1230 at the SMTA International Exposition, scheduled to take place Nov. 2-3, 2022 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

Industry News | 2022-12-21 10:42:04.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.

Nihon Superior Co., Ltd.

Kester's Peter Biocca to Present at SMTA Atlanta 2009

Industry News | 2009-04-13 16:28:45.0

ITASCA, IL � April 2009 � Kester's Peter Biocca, along with Carlos Rivas of SMT Dynamics, will present a paper titled, �Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level,� at the upcoming 13th Annual Atlanta Expo scheduled to take place at 1 p.m. on Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Kester


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