Industry News: sac 305 solder bar profile (Page 2 of 8)

Nihon Superior Launches Ag-free SAC305 Replacement – SN100CV

Industry News | 2023-01-09 18:39:37.0

With its rule-breaking wave solder alloy, SN100C, Nihon Superior Co., Ltd. earned global recognition as an innovator in lead-free solder formulation. The rule that SN100C broke was that you can't make a Pb-free solder without a silver content that doubles the cost of the raw materials. Now Nihon Superior has broken that rule again with SN100CV, a reflow soldering alloy that can outperform SAC305 in reliability while being reflowable with the same thermal profile as SAC305.

Nihon Superior Co., Ltd.

SHENMAO Debuts High Thermal Impact Reliability No-Clean Solder Paste PF918-P250, Elevating Automotive Electronics Performance

Industry News | 2023-12-18 13:13:45.0

SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications. With a focus on enhancing thermal impact reliability, PF918-P250 sets a new standard for performance, delivering superior results for automotive devices and high-power components.

Shenmao Technology Inc.

SHENMAO to Showcase Advanced Automotive Electronic Solutions at 2024 IPC APEX EXPO

Industry News | 2024-03-18 12:35:19.0

SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.

Shenmao Technology Inc.

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Industry News | 2017-06-25 20:33:39.0

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

Shenmao Technology Inc.

The Balver Zinn Group to Supply BRILLIANT B2012 Solder Wire for the APEX Hand Soldering Competition

Industry News | 2015-01-27 10:59:31.0

The Balver Zinn Group announces that Cobar Solder Products Inc. is sponsoring the fourth annual IPC APEX EXPO® Hand Soldering Competition, scheduled to take place Feb. 26, 2015 at the San Diego Convention Center in San Diego, CA. Cobar Solder Products is contributing Balver Zinn’s BRILLIANT B2012 SAC305 (SN97C) solder wire is halide-free, rosin-based and designed for manual and robotic soldering.

Balver Zinn

FCT Assembly Now Offers Lab Services at Its Colorado Facility

Industry News | 2009-10-16 19:20:15.0

GREELEY, CO — FCT Assembly announces that lab services are now offered at its Greeley, CO facility. Conventional 63/37, SN100C® lead-free and SAC305 alloys can be analyzed at the facility.

FCT ASSEMBLY, INC.

AIM Solder’s NC259 Solder Paste Offers Superior Performance

Industry News | 2013-05-07 13:45:19.0

AIM Solder announces that NC259 Solder Paste is a low-cost, lead-free and halogen-free solder paste that offers superior performance comparable to that of tin/lead and high-silver lead-free solder pastes, a virtual drop-in for costly SAC305.

AIM Solder

Cobar to Exhibit Water-Soluble LF3237 Solder Wire at SMTA Upper Midwest

Industry News | 2013-06-06 19:12:21.0

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit Balver Zinn water-soluble LF3237 Solder Wire in Booth #44 at the upcoming SMTA Upper Midwest Expo and Tech Forum, scheduled to take place Thursday, June 27, 2013 at the Embassy Suites in Bloomington, MN

Cobar Solder Products Inc.

What's happening at Nihon Superior in 2008?

Industry News | 2008-03-25 23:59:52.0

Comment from Tetsuro Nishimura, North American Sales Manager

Nihon Superior Co., Ltd.

Indium Corporation Expert to Present on Low-Temperature Solder Paste at SMTA Empire Expo

Industry News | 2023-09-25 17:55:00.0

Indium Corporation R&D Manager, Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang will present at the SMTA Empire Expo & Tech Forum on September 26 in Syracuse, NY. Also at the conference, Regional Sales Manager Emily Belfield will host a panel discussion, Generational Differences in Today's Workplace.

Indium Corporation


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