Industry News: sac 305 solder bar profile (Page 4 of 8)

High Thermal & Impact Reliability Solder Alloys from SHENMAO at IWLPC

Industry News | 2018-10-22 18:35:12.0

SHENMAO Technology today announced plans to exhibit at the International Wafer-Level Packaging Conference, scheduled to take place Oct. 23-25, 2018 at the DoubleTree by Hilton San Jose in California. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys.

Shenmao Technology Inc.

Nihon Superior’s SN100C P600 D4 Paste Wins a 2009 Global Technology Award

Industry News | 2009-11-11 12:21:33.0

OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd. announces that it has been awarded a 2009 Global Technology Award in the category of Soldering Materials for its SN100C P600 D4 Solder Paste. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

Nihon Superior Co., Ltd.

The Balver Zinn Group to Supply BRILLIANT B2012 Solder Wire for the SMT IPC Hand Soldering Competition

Industry News | 2016-04-19 05:13:13.0

The Balver Zinn group announced that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place April 26-28, 2016. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.

Balver Zinn

The Balver Zinn Group to Supply BRILLIANT B2012 Solder Wire for the SMT IPC Hand Soldering Competition

Industry News | 2017-05-09 04:41:07.0

The Balver Zinn group announces that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place May 16-18, 2017. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.

Balver Zinn

Nihon Superior Shanghai to Exhibit at NEPCON China 2012 Implementing Lead-Free Soldering with Cost Reduction and Reliability

Industry News | 2012-03-28 15:59:44.0

Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd. will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai.

Nihon Superior Co., Ltd.

SHENMAO Introduces PF606-P269J Lead-Free Paste Specially Designed for Jet Dispensing

Industry News | 2022-08-14 14:26:09.0

SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

Shenmao Technology Inc.

The Balver Zinn Group to Showcase the Latest Solder Paste Technology at SMTAI

Industry News | 2014-08-25 12:36:56.0

The Balver Zinn Group announces that it will exhibit in Booth #115 at SMTA International, scheduled to take place Sep. 30-Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

Cobar Solder Products Inc.

Cobar Solder Products Exhibits Full Range of Lead-free Solders and Fluxes at IPC/APEX 2009

Industry News | 2009-03-10 17:53:29.0

Londonderry, New Hampshire, USA � Cobar Solder Products will exhibit a complete range of advanced soldering materials ranging from bar solder to SMT solder paste to high-performance fluxes at Apex 2009, in booth#2111.

Cobar Solder Products Inc.

SHENMAO Technology to Exhibit New Solder Alloy with High Thermal & Impact Reliability at SEMICON Southeast Asia

Industry News | 2018-04-25 20:05:59.0

SHENMAO America, Inc. today announced plans to exhibit in Booth 433 at SEMICON Southeast Asia, scheduled to take place May 22-24, 2018 at the new Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur. SEMICON SE Asia is the region's premier gathering of the industry for connecting people, products, technologies and solutions across the global electronics manufacturing supply chain. SHENMAO plans to introduce its new PF906-S and PF912-S solder alloys.

Shenmao Technology Inc.

FCT Assembly to Exhibit Solution-Driven Solder Pastes at the SMTA Capital Expo

Industry News | 2014-09-06 15:26:20.0

FCT Assembly today announced plans to exhibit at the SMTA Capital Expo & Tech Forum, scheduled to take place Tuesday, September 9, 2014 at the John Hopkins University/Applied Physics Lab in Laurel, MD.

FCT ASSEMBLY, INC.


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