Industry News: sac305 pot temperature (Page 2 of 16)

Christopher Associates Debuts S3X-BF70M and 200N Series Wafer Bumping Pastes

Industry News | 2010-12-01 15:42:43.0

Christopher Associates introduces the S3X-BF70M and 200N series wafer bumping pastes. The pastes exhibit a high definition over time and at elevated temperatures.

Christopher Associates Inc.

Indium Corporation Expert to Present on Low-Temperature Solder Paste at SMTA Empire Expo

Industry News | 2023-09-25 17:55:00.0

Indium Corporation R&D Manager, Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang will present at the SMTA Empire Expo & Tech Forum on September 26 in Syracuse, NY. Also at the conference, Regional Sales Manager Emily Belfield will host a panel discussion, Generational Differences in Today's Workplace.

Indium Corporation

Christopher Associates Debuts Koki SB6N58-A730 Low-Temperature Lead-Free Solder Paste

Industry News | 2010-12-07 15:07:35.0

Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.

Christopher Associates Inc.

Nihon Superior Sets New Standards in Lead-Free Soldering Technology at APEX 2024

Industry News | 2024-03-18 12:19:32.0

Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to innovation, Nihon Superior will present a range of groundbreaking products, including the SN100CV® P608 solder paste and the TempSave™ series of low-temperature soldering materials.

Nihon Superior Co., Ltd.

SHENMAO to Exhibit New Solder Pastes with NeVo at productronica

Industry News | 2021-10-11 16:08:26.0

SHENMAO America, Inc. today announced plans to exhibit together with NeVo GmbH at productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. NeVo will showcase Shenmao's PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste and PF606-P245X Lead-Free Solder Paste.

Shenmao Technology Inc.

Nihon Superior to Highlight SN100CV P608 Paste at SMTAI

Industry News | 2023-09-11 17:19:08.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its SN100CV P608 solder paste in Booth #1415 at the SMTA International Exposition, scheduled to take place Oct. 10-11, 2023 at the Minneapolis Convention Center in Minneapolis, MN.

Nihon Superior Co., Ltd.

AIM Solder’s NC259 Solder Paste Offers Superior Performance

Industry News | 2013-05-07 13:45:19.0

AIM Solder announces that NC259 Solder Paste is a low-cost, lead-free and halogen-free solder paste that offers superior performance comparable to that of tin/lead and high-silver lead-free solder pastes, a virtual drop-in for costly SAC305.

AIM Solder

Nihon Superior Introduces SN100C (551CT)

Industry News | 2011-08-18 12:44:10.0

Nihon Superior introduces SN100C (551CT), the newest addition to its SN100C lead-free solder series.

Nihon Superior Co., Ltd.

Gen3 System supplies the Nordson SELECT Novo 460 PD Selective Soldering System for Custom Interconnect Ltd’s production facility in Andover.

Industry News | 2018-08-06 05:59:56.0

Gen3 System supplies the Nordson SELECT Novo 460 PD Selective Soldering System for Custom Interconnect Ltd’s production facility in Andover. The Nordson SELECT Selective Soldering Systems have been honoured with prestigious awards for innovation and excellence. With over 25 years experience in electronics manufacturing they’re proven both a highly experienced and a devoted team to perform flawlessly tailored products.Nordson SELECT have risen to become the foremost worldwide supplier of Selective Soldering Systems.

Gen3 Systems

Kester to Feature Lead-Free Information Center at APEX 2008

Industry News | 2008-02-29 16:42:42.0

ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.

Kester


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