Industry News | 2016-02-16 18:00:40.0
Nihon Superior will exhibit in Booth #2610 at the IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
Industry News | 2011-09-21 12:22:09.0
Nihon Superior will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
Industry News | 2012-07-25 15:16:14.0
The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference
Industry News | 2020-10-31 10:39:48.0
Indium Corporation earned the Mexico Technology Award for its patent-pending Durafuse™ LT low-temperature alloy system.
Industry News | 2021-03-06 03:11:18.0
Indium Corporation will feature the award-winning Durafuse™ LT–the novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications–during Productronica China, held March 17-19 inShanghai, China.
Industry News | 2018-09-11 19:30:04.0
Nihon Superior Co.has developed a new flux-cored solder wire that greatly reduces spatter compared with conventional cored wire. The new cored-flux, (032) allows the use of a wide range of soldering iron tip temperatures with very little spatter, even with high tip temperatures.
Industry News | 2023-03-27 13:09:49.0
Indium Corporation senior technologist Dr. Ronald Lasky will deliver a technical presentation on low-temperature solder at SMTA Houston on March 30.
Industry News | 2019-08-12 20:00:01.0
SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”
Industry News | 2013-11-08 17:55:20.0
Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13-14 in Costa Mesa, California.
Industry News | 2014-02-19 16:03:57.0
Nihon Superior Co. Ltd Nihon Superior will exhibit in Booth #2353 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
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