Industry News: sapphires (Page 1 of 1)

The LCO-350 PCB Laser Depanelizer: Precision Redefined

Industry News | 2023-10-30 01:28:24.0

In the fast-paced world of electronics manufacturing, achieving precision and efficiency is paramount. The LCO-350 PCB Laser Depanelizer stands as a revolutionary solution, pushing the boundaries of PCB (Printed Circuit Board) cutting technology.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Knack Systems will be presenting with Summit Electric and Audio-Technica at SAPPHIRE NOW + ASUG Annual Conference 2016

Industry News | 2016-05-12 03:10:55.0

Knack Systems, a premium SAP consulting partner focused on optimizing the sales, service, marketing, and commerce processes of customers by leveraging SAP customer engagement and commerce solutions.

Knack Systems

PhiChem Joins Underwriters Laboratories (UL®) Standards Technical Panel 796 for Printed Wiring Boards

Industry News | 2015-09-18 15:17:40.0

PhiChem has been accepted as a member of Underwriters Laboratories (UL®) Standards Technical Panel (STP) for Printed Wiring Boards STP796, which covers standards UL746E and UL796. UL746E is the UL Standard for Polymeric Materials – Industrial Laminates, Filament Wound Tubing, Vulcanized Fiber, and Materials Used in Printed-Wiring Board, while UL796 is the Standard for Printed-Wiring Boards.

PhiChem Corporation

Amtech Reports Record Sales for Advanced Packaging Reflow Systems

Industry News | 2020-11-20 17:44:30.0

Amtech Systems, Inc. (NASDAQ: ASYS) announced today that its subsidiary,BTU International, Inc., achieved record sales for its PYRAMAX™ reflow systems sold into advanced packaging applications in fiscal year ending September 30, 2020.

AMTECH

Leica And GiveMePower Present World�s First Laser-Powered Wireless CAD Solution At AIA 2004 National Convention In Chicago

Industry News | 2004-06-10 15:42:07.0

New solution uses wireless DISTO� laser and Windows� mobile computers to improve productivity by up to 1000%

GiveMePower Corp.

Temporary Bonding Adhesive for Thin Wafer Handling

Industry News | 2016-08-17 09:26:56.0

AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.

AI Technology, Inc. (AIT)

Green Lighting Shanghai 2012 to Highlight Trends in Local and International LED Lighting Standards

Industry News | 2012-04-09 12:06:44.0

With the rapid development of the LED industry, China has become a major production and export hub

Reed Exhibitions

LED Industrial Investment: Fire & Ice

Industry News | 2012-09-25 09:40:02.0

As the saying goes, “In the Yangtze River, the waves behind drive on those before with the old waves vanishing on the shore.” This aptly describes the status of the domestic LED industrial investment.

Reed Exhibitions

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sapphires searches for Companies, Equipment, Machines, Suppliers & Information

2024 Eptac IPC Certification Training Schedule

Best Reflow Oven
Blackfox IPC Training & Certification

World's Best Reflow Oven Customizable for Unique Applications
SMT feeders

Wave Soldering 101 Training Course
thru hole soldering and selective soldering needs

Software for SMT placement & AOI - Free Download.
PCB Depanelizers

Thermal Transfer Materials.