Industry News: scanning acoustic microscope (Page 1 of 8)

Solve your semiconductor packaging problems with Nordson ELECTRONICS SOLUTIONS at SEMICON Taiwan 2020

Industry News | 2020-09-17 12:23:10.0

Talk to the experts and see demonstrations of the latest equipment for test and inspection, fluid dispensing, and plasma treatment in one booth, #I2716

ASYMTEK Products | Nordson Electronics Solutions

NEW IPC DVD PROVIDES TRAINING ON DETECTING COUNTERFEIT COMPONENTS

Industry News | 2014-05-14 16:54:20.0

A newly released training video, DVD-166C, “Counterfeit Components” from IPC — Association Connecting Electronics Industries®, explains not only how counterfeit components find their way into the supply chain, but more important, how to detect fraudulent devices during visual inspection.

Association Connecting Electronics Industries (IPC)

Microtronic GmbH to Show Sonix ECHO™ Scanning Acoustic Microscope at SMT Hybrid Packaging

Industry News | 2017-04-23 11:52:40.0

Microtronic GmbH today announced plans to show the Sonix ECHO™ scanning acoustic microscope in Stand 221j in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany. The ECHO™ enables package inspection of stacked dies, complex flip chips and more traditional plastic packages.

Microtronic GmbH

Microtronic GmbH Enters Distribution Agreement with Pemtron for Scanning Electron Microscopes

Industry News | 2017-04-05 11:18:26.0

Microtronic GmbH is pleased to announce that it has added the PEMTRON PS™ Series Scanning Electron Microscopes (SEMs) to its product line up in parts of the EU. The PS Series Models include the PS-210 Compact Desk Top Mini-SEM, the PS-230 High Performance Normal-SEM, and PS-250 Analytical Normal-SEM.

Microtronic GmbH

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:50:57.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:56:07.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Microtronic to Display Range of Products at SMT/Hyrbid/Packaging 2015

Industry News | 2015-04-07 15:34:16.0

Microtronic GmbH, a leading sales specialist of microelectronics, will display a range of products in Booth # 7-101L at SMT/Hybrid/Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

Microtronic GmbH

Microtronic to Exhibit at the IMAPS EMPC in Germany

Industry News | 2015-09-03 15:44:25.0

Microtronic today announced plans to exhibit at the 20th European Microelectronics and Packaging Conference & Exhibition (EMPC), scheduled to take place Sept. 14-16, 2015 in Friedrichshafen, Germany. Company representative will demonstrate the Microtronic LBT-210, Akrometrix TherMoiré AXP and Sonix ECHO™ as well as specialty solders from AIM.

Microtronic GmbH

Nordson Test & Inspection Unveils Latest Inspection and Metrology Solutions at SEMICON West 2025

Industry News | 2025-10-01 16:51:02.0

Nordson TEST & INSPECTION today announced plans to exhibit at SEMICON West 2025, scheduled to take place October 7-9th at the Phoenix Convention Center in Arizona. Visitors to booth 5745 will have the opportunity to see demonstrations of Nordson's WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), Gen 7™ Acoustic Micro Imaging (AMI) system and 4800 Integra Bond Tester.

Nordson Corporation

Nordson Test & Inspection Launches Advanced Inspection and Metrology Solutions at Productronica & SEMICON Europa 2025

Industry News | 2025-11-03 14:30:58.0

Nordson TEST & INSPECTION today announced plans to exhibit with distributor partners at Productronica and SEMICON Europa, scheduled to take place November 18-21 at the Messe Munchen in Munich, Germany. Visitors to SmartTec's booths #A2.540, A2.537 and HTT's booth # B1.102 will have the opportunity to see demonstrations of Nordson's WaferSense® semiconductor sensors, SQ5000™Pro Multi-Function system for AOI, SPI and CMM, Quadra Pro™ Manual X-Ray system (MXI), Gen 7™ Acoustic Micro Imaging (AMI) system and X3 Automated X-Ray (AXI) system with Dynamic Planar CT.

Nordson Corporation

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