Industry News: scrap stencils (Page 1 of 1)

Electronics Reliability And Sustainability Focus of IPC Technical Conference

Industry News | 2010-08-04 21:04:22.0

Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.

Association Connecting Electronics Industries (IPC)

FINE LINE STENCIL Wins a 2008 VISION Award for Its Slic-Blade Squeegee Blades

Industry News | 2008-04-08 22:33:32.0

COLORADO SPRINGS, CO � April 2, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded a SMT VISION Award in the category of Assembly Tools for its innovative Slick-Blade Squeegee Blades. The award was presented to the company during a Wednesday, April 2, 2008 ceremony that took place in Las Vegas during APEX 2008.

FCT ASSEMBLY, INC.

FINE LINE STENCIL Wins a 2008 Advanced Packaging Award for Its Slic-Blade Squeegee Blades

Industry News | 2008-07-19 14:36:57.0

COLORADO SPRINGS, CO � July 16, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded an Advanced Packaging Award in the category of Handling Equipment/Fixtures for its innovative Slick-Blade Squeegee Blades. The award was presented to the company during a Wednesday, July 16, 2008 ceremony that took place at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

FCT ASSEMBLY, INC.

FCT Assembly to Debut New NanoSlic™ Multilayer Coating at the IPC APEX EXPO

Industry News | 2013-01-17 09:22:05.0

FCT Assembly announces that it will highlight its new NanoSlic™ Multilayer Coating for the first time in booth #2627 at the upcoming IPC APEX EXPO

FCT ASSEMBLY, INC.

FCT Assembly Offers Summer Savings

Industry News | 2011-06-07 21:58:13.0

FCT Assembly announces that for the month of June, customers can receive a 20 percent discount on all solder and stencil orders placed at its online store. FCT Assembly developed the new storefront to allow customers to purchase merchandise directly from the company online in an effort to enhance user convenience.

FCT ASSEMBLY, INC.

FCT Recovery Expands Inside Sales Team

Industry News | 2013-04-11 19:00:16.0

FCT Recovery announces the appointment of two new sales representatives. Catie Hill and Kate Mattern have joined the FCT Recovery inside sales team, effective immediately.

FCT ASSEMBLY, INC.

FCT Assembly Celebrates a Decade of Growth

Industry News | 2014-01-08 17:39:49.0

FCT Assembly today announced that the company will celebrate 10 years in business in 2014. Founded in April 2004 by Mike Scimeca as a spin-off of Florida CirTech, FCT was established to supply the electronics assembly market with laser cut SMT stencils and high-quality solder products.

FCT ASSEMBLY, INC.

AMTECH Introduces a New Solder Paste, VS-213, Also Known as the Voidstopper

Industry News | 2014-06-17 21:50:29.0

SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.

AMTECH

DEK ProFlow ATx Tops Performance and Cost-Efficiency among Enclosed Head Print Systems

Industry News | 2010-04-22 16:26:45.0

DEK's ProFlow® system is arguably the gold-standard for enclosed head printing technology. With nearly a decade of documented process advance under its belt, ProFlow has now evolved to deliver even greater electronics assembly performance, ease-of-use and environmental responsibility with ProFlow ATx.

ASM Assembly Systems (DEK)

Koh Young SPI Dispenses Solder Paste for 0402M (01005) Microchips

Industry News | 2018-09-04 10:25:16.0

Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.

Koh Young America, Inc.

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