Industry News | 2003-02-12 09:25:17.0
35% stake in Topgrow Technologies
Industry News | 2003-02-05 08:29:10.0
In Hopes of Convincing Legislators that there�s Still Time to Resuscitate the State PCB Industry
Industry News | 2003-04-30 08:51:08.0
Electrolube played the role of environmental champion in Australia recently.
Industry News | 2003-06-18 08:04:27.0
Recently purchased and installed a new DP-1500-2X Dual-Sided Photoimageable Ink Coater from Circuit Automation
Industry News | 2003-04-18 08:31:57.0
Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.
Industry News | 2021-12-09 09:26:46.0
Baja Bid is liquidating excess equipment via online auction. The bidding for this event is now open and the closing will begin today at 1:00 pm EST.
Industry News | 2001-12-17 07:49:03.0
The following IPC products have now been released.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2010-06-04 16:23:16.0
BANNOCKBURN, Ill., USA — The IPC Solder Products Value Council (SPVC) has published a free white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for the evaluation of new lead-free alloys on the basis of their physical properties. Developed in cooperation with leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) companies, the white paper will help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.
.gif)
winsouce.jpg)