Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2001-01-29 14:45:47.0
Addressing the electronics industry's need for a cost-effective odd form placement and final assembly workcell, Universal Instruments Corp. has launched the new Polaris Assembly Cell.
Industry News | 2021-09-24 13:31:07.0
Investments over the past 18 months support continuing technology advancements and business growth at the electronics design and contract manufacturing center near Rochester, NY
Industry News | 2009-01-19 20:34:37.0
Essemtec, the leading manufacturer of surface mount technology production equipment, announces that it will highlight the printer SP150, the pick & place machine Pantera XV and the full convection oven RO300FC-C with RO-CONTROL software in hall no. 18, stand no. 338 at the upcoming COMPONEX NEPCON 2009 exhibition, scheduled to take place February 24-26, 2009, in Delhi, India.
Industry News | 2012-08-15 12:25:12.0
NEPCON South China 2012 will take place between August 28 and August 30, 2012 at the Shenzhen Convention & Exhibition Center
Industry News | 2012-08-20 07:56:16.0
NEPCON South China 2012will be present with their new products, providing a comprehensive showing of the latest electronics production equipment products and technologies.
Industry News | 2014-11-17 18:28:37.0
PARMI announces the development of the xLink adapter to enable real-time connectivity of SPI results to Aegis’ FactoryLogix Manufacturing Operations Systems. With real-time data integration, manufacturers immediately can identify SPI defects and take corrective actions to improve PCB yield.
Industry News | 2014-11-18 17:45:47.0
PARMI and Aegis Software announce the development of the xLink adapter to enable real-time connectivity of SPI results to Aegis’ FactoryLogix Manufacturing Operations Systems. With real-time data integration, manufacturers can immediately identify SPI defects, and take corrective actions to improve PCB yield.
Industry News | 2014-02-13 16:26:07.0
Gen3 Systems Limited today announced that they will exhibit at National Electronics Week (NEW) ADEC Expo South Africa, scheduled to take place March 11-12, 2014 at the Gallagher Convention Centre in Midrand, Johannesburg. Quamba Technologies, Gen3’s South African Distributor, will be exhibiting alongside Gen3 and will be displaying the European Product of the Year, the Gensonic Stencil Cleaning system.
Industry News | 2022-04-13 10:15:50.0
Indium Corporation's Dr. Ron Lasky will share his technical insight on the importance of Design of Experiments to optimize the electronics assembly process as part of the company's popular InSIDER Series of webinars. The presentation, Design of Experiments (DOE) for SMT 101, will take place on Tuesday, May 3, at 10:30 a.m. San Francisco/1:30 p.m. New York/6:30 p.m. London/7:30 p.m. Germany.
