Industry News: seho mws 2340 (Page 1 of 1)

Miele & Cie. KG Invests in SEHO Manufacturing Line

Industry News | 2010-09-08 14:52:59.0

SEHO Systems GmbH, a worldwide leading manufacturer of soldering systems, announces that Miele & Cie. KG, a traditional manufacturer of domestic appliances based in Gütersloh, Germany, has invested in a new THT manufacturing line from SEHO.

SEHO Systems GmbH

SEHO to Show Innovations for Its Entire Range of Products at productronica

Industry News | 2019-10-16 14:38:04.0

SEHO Systems GmbH will exhibit in Hall A4, Booth #578 at the upcoming productronica, scheduled to take place Nov.12-15, 2019 in Munich, Germany. The company will showcase innovative features for its product range. The new functions are designed to bring process reliability to a higher level and further improve production sequences in electronic manufacturing.

SEHO Systems GmbH

SEHO to Show Solutions for Cost-Efficient High-Mix Production at APEX

Industry News | 2020-01-07 11:28:02.0

SEHO North America, Inc. will highlight innovative solutions for cost-efficient high-mix production in Booth #1451 at the IPC APEX EXPO, scheduled to take place Feb. 4 - 6, 2020 at the San Diego Convention Center.

SEHO Systems GmbH

SEHO to Present New Solutions for Wave Soldering Processes

Industry News | 2020-03-08 16:35:13.0

SEHO North America, Inc. will exhibit at the SMTA Intermountain Expo & Tech Forum, scheduled to take place March 10, 2020 at the Boise State University in Idaho. The company will discuss the latest innovations for cost-efficient high-mix wave soldering.

SEHO Systems GmbH

SEHO MWS 2300 Provides Automatic Nozzle Height Adjustment

Industry News | 2021-01-30 07:05:46.0

Most wave soldering systems installed in electronic productions are equipped with one or two solder nozzles that generate a turbulent wave. This configuration is ideal for most products; however, this concept reaches its limitations if, for example, PCBs in masks are to be processed. The reliable wetting of all solder jointsis not guaranteed, depending on the thickness of the mask and the size of the cutouts. Additionally, it might be challenging to achieve a reproducible process if the distances between covered SMD components and the THT pins to be soldered are too small. Sophisticated assemblies that are processed in soldering masks often show soldering defects such as incomplete solder joints or solder bridges.

SEHO Systems GmbH

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