Industry News: selective soldering top 5 (Page 9 of 99)

RENEE MICHALKIEWICZ ELECTED TO CHAIR TOP IPC STANDARDS LEADERSHIP COMMITTEE

Industry News | 2014-04-11 09:06:53.0

Renee Michalkiewicz, MIT, general manager, Trace Laboratories, Baltimore, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term.

Association Connecting Electronics Industries (IPC)

LIVE ELECTRONICS ASSEMBLY LINE FEATURED AT ELECTRONICS MIDWEST

Industry News | 2010-09-02 16:09:40.0

Each step in the electronics assembly process will be on display and fully functioning on the show floor at Electronics Midwest, produced by IPC — Association Connecting Electronics Industries® and Canon Communications.

Association Connecting Electronics Industries (IPC)

IPC APEX EXPO 2019 … Exhibit Space Going Fast

Industry News | 2018-06-26 20:45:20.0

IPC – Association Connecting Electronics Industries® reports that 85 percent of exhibit floor space has been sold for IPC APEX EXPO® 2019. Three hundred twenty-seven exhibitors have been assigned to 134,200 net square feet of exhibit space, marking a 5 percent increase in square footage compared to 2018’s booth space selection event. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 29–31, 2019, at the San Diego Convention Center in San Diego, Calif.

Association Connecting Electronics Industries (IPC)

FREE Soldering and Assembly Defects - Causes and Cures Webinar

Industry News | 2010-12-01 14:28:16.0

With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.

Association Connecting Electronics Industries (IPC)

Nordson Electronics Solutions to demonstrate plasma treatment and automated fluid dispensing systems for electronics manufacturing at SEMICON China 2024

Industry News | 2024-03-11 15:00:03.0

Connect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645

Nordson Electronics Solutions

I.C.T Automated Optical Inspection (AOI) to Improve SMT Line Efficiency

Industry News | 2022-10-12 08:07:17.0

I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the circuit board assembly line. The basic principle of AOI is to judge whether the object to be tested meets the standard by comparing whether there is a large difference between the object to be tested and the standard image by using image technology. AOI emits a 4-color light source to the PCBA board, which is automatically scanned by an industrial camera for catastrophic failures, such as missing components or quality defects. Therefore, the quality of AOI depends on the image imaging ability, algorithm parsing ability and image discrimination technology. I.C.T AOI has done well in these aspects.

Dongguan Intercontinental Technology Co., Ltd.

Electronics in Harsh Environments Conference Program Finalized

Industry News | 2018-02-06 20:38:21.0

SMTA Europe is excited to announce the finalized program for Electronics in Harsh Environments Conference. The event will be held April 24-26, 2018 at the Crowne Plaza Amsterdam – Schiphol in Amsterdam, Netherlands.

Surface Mount Technology Association (SMTA)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)


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