Industry News | 2011-07-26 22:29:00.0
It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.
Industry News | 2011-09-01 20:33:47.0
Bragging rights are on the line as the First Annual IPC Midwest Soldering Competition takes place, September 21-22, in Schaumburg, Ill., to determine the Best Hand-Soldering Technician in the Midwest for 2011.
Industry News | 2011-11-11 14:38:51.0
Want to get a handle on commonly used electronics industry acronyms and terminology? Look no further than the definitive resource, IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. Recently released by IPC, the J revision of IPC-T-50 contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.
Industry News | 2012-01-07 21:49:07.0
As EMS companies have ramped up speeds to meet the high demand for electronics, equipment manufacturers have responded by developing machines that quickly shift from handling one package style to another with fewer sacrifices in precision. To help industry determine the best equipment setup to meet needs for speed, capability and accuracy, IPC has released revision A to IPC-9850, Surface Mount Placement Characterization, making it far simpler to quantify the performance of placement equipment.
Industry News | 2012-07-17 20:55:30.0
First Step in IPC’s Printed Electronics Initiative to Help Industry Grow
Industry News | 2012-11-27 15:24:14.0
IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.
Industry News | 2012-12-03 19:52:39.0
Printed Board Assembly Cleaning and Contamination Testing Center marks its debut at IPC APEX EXPO®, February 19–21, 2013, at the San Diego Convention Center.
Industry News | 2013-07-01 19:34:57.0
The decision of who will be the Opening Keynote at IPC APEX EXPO® 2014, March 25–27 in Las Vegas, is being put to a vote.
Industry News | 2018-07-26 19:29:58.0
IPC – Association Connecting Electronics Industries® is applauding leaders in the U.S. House and Senate for finalizing the FY2019 National Defense Authorization Act (NDAA) and including a provision on military electronics backed by IPC.
Industry News | 2019-11-12 13:05:37.0
IPC announces industry programs to support implementation and full utilization of IPC Connected Factory Exchange–IPC CFX. IPC CFX enables any manufacturing facility, large or small, to achieve Industry 4.0, IIoT and smart factory objectives. IPC CFX is a single-source, plug-and-play system supported by IPC-2591, Connected Factory Exchange (CFX), an open international standard developed by industry for industry. IPC CFX uses a secure license-free communication protocol that can reduce/eliminate reliance on middleware -- a constant source of headaches in smart factory implementation.
