Industry News: senju solder paste water soluble jet (Page 16 of 25)

SHENMAO Develops Thermal Fatigue-Resistant Solder Paste PF918-P250 for High-Reliability Requirements

Industry News | 2024-06-10 10:22:35.0

SHENMAO Technology proudly announces the development of its new thermal fatigue-resistant solder paste, PF918-P250. Designed to meet high-reliability requirements, PF918-P250 offers advanced features and superior performance for electronic products requiring exceptional durability.

Shenmao Technology Inc.

SHENMAO Recycled Solder Materials PF606R-PW215 and PF629R-B Receive UL ECVP 2809 Certification

Industry News | 2024-07-15 11:37:32.0

SHENMAO America, Inc. is pleased to announce that its various solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure, UL ECVP) certification for Recycled Content Standard, which now includes auditing of social responsibility procedures.

Shenmao Technology Inc.

Aqueous Technologies to Display StencilWasher-CLR at APEX 2008

Industry News | 2008-03-14 19:40:53.0

Rancho Cucamonga, CA - March 2008 � Aqueous Technologies Corp. announces that it will highlight StencilWasher-CLR in booth 2431 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, 2008 in Las Vegas.

Aqueous Technologies Corporation

In-Line Flip Chip Cleaning Now Available With AAT'S New HydroJet Flip Chip Inline Cleaner

Industry News | 2001-08-24 10:09:50.0

Austin American Technology has successfully qualified and is now introducing an automated cleaning and drying system based on its highly successful Mach I and Mach III Series HydroJet Inline Cleaner. Advances and improvements in the configuration of the system have given it the ability to efficiently clean and thoroughly dry delicate Flip Chip assemblies at in-line speeds.

Austin American Technology

Shenmao Recycled Solder Materials to Be Certified to UL ECVP 2809

Industry News | 2022-09-08 06:51:46.0

Shenmao America, Inc. is pleased to announce that four of its solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure, UL ECVP) for Recycled Content Standard which now includes auditing of social responsibility procedures. Additionally, more of its recycled tin products will be UL certified in the near future.

Shenmao Technology Inc.

SHENMAO Introduces Rosin-Free No-Clean Liquid Flux SM-ZR10 for Automatic Wave Soldering Process

Industry News | 2024-08-12 15:07:45.0

SHENMAO America, Inc. is pleased to announce the launch of its latest innovation, the Rosin-Free No-Clean Liquid Flux SM-ZR10, specifically designed for automatic wave soldering processes. The no-clean liquid flux offers superior soldering performance, easy maintenance, and compliance with stringent environmental standards.

Shenmao Technology Inc.

SHENMAO Offers Halogen-Free SM-862 Liquid Flux as a Replacement for SM-816

Industry News | 2023-07-19 09:24:50.0

SHENMAO America, Inc. is pleased to announce the availability of its halogen-free SM-862 Liquid Flux, designed to replace the widely used halogenated SM-816. The SM-862 Flux offers a range of benefits, including low solid content and smooth residue, making it an excellent choice for automatic wave soldering and manual dipping processes.

Shenmao Technology Inc.

SHENMAO to Present at the 31st Annual Electronics Packaging Symposium

Industry News | 2019-08-12 20:00:01.0

SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”

Shenmao Technology Inc.

Aqueous Technologies Introduces StencilWasher MP � The Vertical Format Misprint and Stencil Cleaning System

Industry News | 2009-02-11 23:36:26.0

RANCHO CUCAMONGA, CA � February 2009 � Aqueous Technologies Corp. announces the StencilWasher MP, a fully automatic misprint and stencil cleaning system that is designed to remove non-reflowed solder paste and adhesives from misprinted assemblies, stencils, and screens, as well as post-reflow circuit assemblies.

Aqueous Technologies Corporation

SHENMAO Presents Technical Paper at SMTA/ICSR Conference

Industry News | 2016-04-21 00:17:09.0

SHENMAO Technology will present the technical paper "A New Dispensing Solder Paste for Laser Soldering Technology" at the 10th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.

Shenmao Technology Inc.


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