Industry News: senju solder paste water soluble jet (Page 7 of 25)

FCT Assembly to Highlight a Range of New Pastes at APEX 2010

Industry News | 2010-03-24 12:57:09.0

GREELEY, CO — FCT Assembly to highlight its range of new solder pastes in booth 2317 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

FCT ASSEMBLY, INC.

SHENMAO Celebrates 50 Years of Developing Solder Materials

Industry News | 2023-01-09 18:34:46.0

SHENMAO America, Inc. today announced the company's 50th anniversary as a leading solder material manufacturer. As an award-winning supplier of electronics assembly and semiconductor packaging materials, the company has a reputation for its quality service.

Shenmao Technology Inc.

SHENMAO Awarded for Lead & Halogen-Free Solder Wire

Industry News | 2020-10-27 12:41:51.0

SHENMAO America, Inc. received a 2020 Mexico Technology Awardin the category of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire.The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.

Shenmao Technology Inc.

SHENMAO Offers Industry-Leading UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV

Industry News | 2023-04-24 19:16:05.0

SHENMAO America, Inc. is proud to announce the release of its new product, the UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV. This innovative new solder paste is designed to meet the demands of modern electronics manufacturing, offering excellent performance and reliability.

Shenmao Technology Inc.

Austin American’s NanoJetTM Aqueous Inline Cleaning System Takes New Product (NPI) Award at APEX 2013

Industry News | 2013-03-26 23:33:20.0

AAT's new Nanojet™ won a coveted New Product Introduction (NPI) Award, which was presented to Steve Stach, President, on February 19 at IPC/APEX 2013 in San Diego, California. The annual award recognizes innovative and industry-leading new products in electronics manufacturing.

Austin American Technology

SHENMAO Launches the SMF-UL51 Ultra-Low-Residue Flux for No-Clean Packaging Processes

Industry News | 2018-09-26 11:50:32.0

SHENMAO America, Inc. is pleased to introduce its SMF-UL51, which is a no-clean, halogen-free, ultra-low-residue spray flux. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

Shenmao Technology Inc.

Mycronic to demonstrate enhanced process control solutions for flexible PCB assembly at IPC APEX EXPO

Industry News | 2022-01-29 14:25:31.0

As a leading global partner for integrated PCB assembly solutions, Mycronic will continue to demonstrate the benefits of the flexible factory at IPC APEX EXPO in San Diego, January 25-27, 2022. In addition to the latest in integrated SMT assembly solutions, advanced jet printing technology, dispensing and material handling solutions, the company will highlight recent advances in 3D inspection technologies, process analysis tools and process control software.

Mycronic Technologies AB

New Low Temperature Solder Paste from SHENMAO at SMTA Ohio

Industry News | 2018-07-08 18:45:56.0

SHENMAO America, Inc. today announced plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 12, 2018 at the Embassy Suites Cleveland Rockside. Company representatives will showcase the new PQ10 Low Temperature Solder Paste.

Shenmao Technology Inc.

SHENMAO Introduces New Joint-Enhanced Solder Paste Series

Industry News | 2020-12-01 02:52:15.0

SHENMAO America, Inc. is pleased to introduce its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste.

Shenmao Technology Inc.

SHENMAO Offers Quality Low-Temperature Solder Paste for SMT Devices

Industry News | 2019-05-20 18:51:08.0

SHENMAO America, Inc. introduces PF735-PQ10 Low Temperature Solder Paste. Qualified by a third-party organization, the PQ10 series of low temperature solder paste is made with a modified Sn/Bi alloy that has a lower melting point range from 137°~142°C to 137°~170°C. This makes it ideal for SMT devices, which can have sensitive components that cannot withstand higher temperatures.

Shenmao Technology Inc.


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