Industry News: senju solder paste water soluble jet (Page 8 of 25)

SHENMAO Introduces Thermal Fatigue Resistant Solder Alloy

Industry News | 2021-03-04 08:51:46.0

SHENMAO America, Inc. has introduced its PF719-P250 thermal fatigue resistant solder alloy for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.

Shenmao Technology Inc.

Environmentally Responsible / Operator Safe Stencil Cleaning

Industry News | 2007-11-08 19:31:27.0

Simple Green� Stencil and Misprint Cleaner is specifically designed to remove all SMT solder pastes including Resin, Water-Soluble, No-Clean, Lead and Lead-Free from stencils, screens, and misprints.

Aqueous Technologies Corporation

Soldering and Joint Encapsulation with One Step Reflow from SHENMAO

Industry News | 2021-08-26 11:02:27.0

SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.

Shenmao Technology Inc.

SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 To Solve HoP Issues and Improve ICT Testability at SMTAI Exhibition

Industry News | 2017-09-12 20:15:18.0

SHENMAO Technology introduces New Generation Lead-free Solder Paste PF606-P140. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues and can easily fit into highly complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Industry News | 2017-11-28 09:32:15.0

SHENMAO Technology introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability, Sponsors MEPTEC SEMICONDUCTOR PACKAGING SYMPOSIUM November 30, 2017, E

Industry News | 2017-11-28 19:46:04.0

SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.

PAC Closes Major Solder Paste Account for FCT Assembly in Southern CA

Industry News | 2013-05-29 16:43:31.0

FCT Assembly today announced that its representative Production Automation Corp (PAC) closed a new solder paste account for FCT in Southern California.

FCT ASSEMBLY, INC.

SHENMAO Hires Don Dennison as New East Coast Rep

Industry News | 2018-07-02 21:37:24.0

SHENMAO America, Inc. is pleased to announce the appointment of Mr. Don Dennison of PIT Equipment Services to be their manufacturer’s rep covering Southeastern New York, New Jersey and Eastern Pennsylvania.

Shenmao Technology Inc.

SHENMAO's New PF606-P245X Lead-Free Solder Paste Wins 2021 Mexico Technology Award

Industry News | 2021-11-05 07:21:02.0

SHENMAO America, Inc. is pleased to announce that it received a 2021 Mexico Technology Award in the category of Solder Paste for its new PF606-P245X Lead-Free Solder Paste. The award was announced at a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

Shenmao Technology Inc.

MYDATA ANNOUNCES FIRST STENCIL-FREE SOLDER PASTE PRINTER

Industry News | 2005-10-03 14:38:41.0

STOCKHOLM, SWEDEN (September 13, 2005)

Mycronic Technologies AB


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