Industry News: senju wave solder problem (Page 5 of 13)

SEHO’s PowerWave N2 Tunnel Design Ensures High Energy Efficiency

Industry News | 2016-09-22 18:02:56.0

SEHO Systems GmbH will exhibit in Booth 5B05-5B03 with its representative for Spain and Portugal, Propelec S.A., at MATELEC, scheduled to take place Oct 25-28, 2016 in Madrid, Spain. The PowerWave N2, equipped with a closed tunnel system, will be on display at the show. The booth will be divided in two sections: a display area for the machines and a waiting / discussion area with "Manolo's Bar" serving drinks and his famous tapas.

SEHO Systems GmbH

SEHO to Exhibit at the SMTA Rocky Mountain Expo

Industry News | 2019-02-04 20:01:37.0

SEHO North America will exhibit at the SMTA Rocky Mountain Expo & Tech Forum, scheduled to take place Thursday, Feb. 21, 2019 at the West Club at Mile High Stadium in Denver, CO. The company will discuss the PowerWave N2, ideally suited for medium to large production series. The system offers remarkable performance at simultaneously low investment costs.

SEHO Systems GmbH

Advantages of Design for Manufacturability Rules

Industry News | 2018-10-18 11:09:41.0

Advantages of Design for Manufacturability Rules

Flason Electronic Co.,limited

Ersa to Demo High-Performance Wave Solder Automation Line at APEX

Industry News | 2020-01-07 11:01:33.0

Kurtz Ersa Inc. today announced plans to exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. Company representatives will showcase Ersa‘s wave soldering, reflow soldering, selective soldering, rework equipment, I4.0 connectivity and more in Booth #844.

kurtz ersa Corporation

SHENMAO America to Solve Solder Paste Problems at APEX

Industry News | 2018-01-24 20:47:58.0

SHENMAO America today announced plans to exhibit in Booth #2344 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company’s new PF606-P140 / PF606-P245 Lead-free Zero Halogen Solder Pastes can eliminate Head-in-pillow (HiP) defects, voids, slumping, non-wetting opens and short stencil life.

Shenmao Technology Inc.

Lead-Free (Pb-Free) Solder and Composition

Industry News | 2018-12-08 03:38:44.0

Lead-Free (Pb-Free) Solder and Composition

Flason Electronic Co.,limited

Printed Circuit Board Solder resist

Industry News | 2018-10-18 10:24:59.0

Printed Circuit Board Solder resist

Flason Electronic Co.,limited

The Benefits of Embedded Discrete Components

Industry News | 2018-10-18 10:29:29.0

The Benefits of Embedded Discrete Components

Flason Electronic Co.,limited

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Nitrogen Protection Reflow Oven

Industry News | 2018-10-18 08:55:30.0

Nitrogen Protection Reflow Oven

Flason Electronic Co.,limited


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