Industry News: servo (Page 18 of 30)

Sono-Tek Announces successful completion of 2008 Asia training conference

Industry News | 2008-10-26 00:25:24.0

Milton, NY � October 2008 � Sono-Tek Corporation, the world leader in the development and application of liquid ultrasonic atomization technology into nozzle systems and spray coating application systems, announces the successful completion of its 2008 Asia training conference.

SONO-TEK CORPORATION

MANNCORP.COM LAUNCHES NEW TURNKEY SECTION SHOWCASING 7 COMPLETE SMT ASSEMBLY SYSTEMS

Industry News | 2010-01-11 15:10:30.0

Manncorp has introduced seven new electronic assembly turnkey lines with throughput rates ranging from prototyping to 10,500 cph. The lines are described at www.manncorp.com/turnkey and according to CEO Henry Mann, are targeted to “OEMs and others who are considering turning away from outsourcing by bringing PCB assembly in-house for the first time. The systems are also beamed to existing assemblers who wish to upgrade to latest-generation equipment.”

Manncorp

Manncorp's 6,400 CPH dual-head MC-392 pick-and-place features ball screw X-Y and 30um, 3 sigma accuracy

Industry News | 2010-12-01 13:36:54.0

Although all five models in Manncorp’s latest-generation MC series pick-and-place systems have received industry acclaim, one system in particular has stood out for its extraordinary price/performance ratio, according to CEO Henry Mann.

Manncorp

Manncorp P&P Assembles 4-Foot-Long LED Light Panels

Industry News | 2011-03-28 13:38:37.0

The continued popularity of LEDs – most notably in automobiles, energy-conserving lighting and consumer electronics – has caused Manncorp to roll out another LED-enabled pick and place system. The MC-392LED, according to CEO Henry Mann, "has features that will win approval from traditional SMD assemblers as well as those who mount diodes."

Manncorp

Manncorp Replaces MC384 With Advanced High-Flexibility Pick & Place At Same Price

Industry News | 2011-12-07 00:01:07.0

A new replacement for the widely sold MC384 pick and place has been announced by Manncorp. Aside from the many technological and mechanical breakthroughs permitting improved flexibility, accuracy and speed (5,000 cph), the new MC385V1V, according to CEO Henry Mann, “is totally compatible with its predecessor, allowing the 1,000+ MC384 owners worldwide to use existing feeders and programs in the new machine without concern.”

Manncorp

Fuji Announces NXT III

Industry News | 2013-05-13 01:37:26.0

Fuji Machine Mfg. Co., Ltd. is excited to announce the upcoming release of its newly developed NXT III mounting platform. The latest edition to the NXT series offers improved performance in all areas and continues the evolution of a machine which has now sold more than 40,000 modules all over the world, covering every imaginable production type and volume.

FUJI CORPORATION

Gorilla Circuits Purchases ERSA POWERFLOW N2 Wave and VERSAFLOW 3/66 Selective Solder machine

Industry News | 2013-11-27 11:26:06.0

Kurtz Ersa North America announces that Gorilla Circuits purchased a POWERFLOW N2 Full Nitrogen Tunnel Wave Solder Machine and VERSAFLOW 3/66 selective soldering machine.

kurtz ersa Corporation

Ohio-Based Contract Manufacturer Purchases Ersa’s VERSAFLOW 3/45

Industry News | 2014-01-24 09:55:19.0

LSI ADL Technology LLC Selects the VERSAFLOW 3/45 In-line Selective Solder System

kurtz ersa Corporation

Speedline Launches New Electrovert® Electra™ Next Generation Wave Soldering System

Industry News | 2014-06-12 18:40:43.0

The new Electrovert® Electra™ by Speedline Technologies® is the "Next Generation" in wave soldering systems, offering innovative new features and enhanced performance that make it the most ‘state-of-the-art’ wave soldering system to be launched into the marketplace to date, according to Geoff Klein, Electrovert's General Manager.

Speedline Technologies, Inc.

Toddco General, Inc. TG-1000 Hot Bar Bonding System for large displays and substrates

Industry News | 2014-08-16 17:55:06.0

Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.

Toddco3


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