Industry News | 2016-09-02 03:22:09.0
We present the market leading Condor Sigma W12, equipped with a rotating 13500W 518x513mm heater stage that can uniformly warm up your sample to temperatures up to 175°C. The system is designed for die shear testing on large rectangular glass carriers and 12 inch round carriers, to test glued or solder interconnections on a coating.
Industry News | 2021-08-13 08:37:00.0
Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system to support the testing of electronic components for restricted substances such as lead or tin above specified limits. The system can also verify the coating thickness. Defense base customers often require XRF verification testing of components after components have been processed through lead-free to leaded solder alloy exchange for tin mitigation applications. XRF testing may also be required to verify RoHS compliance of components that have been re-balled or re-processed for lead-free applications. In addition to XRF testing, Circuit Technology Center also supports ionic cleanliness testing, X-ray, Acoustic Microscopy, Solderability, and BGA ball shear testing services.
Industry News | 2024-03-18 12:13:13.0
Heraeus Electronics is excited to announce its participation in the upcoming 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. Heraeus Electronics will be exhibiting in Booth 3912, showcasing its cutting-edge products, including the award-winning Microbond® SMT660 Innolot® 2.0 solder paste.
Industry News | 2015-08-27 09:41:13.0
Seika Machinery will exhibit in Booth #707 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The Seika team will be available to demonstrate the following equipment: DEN-ON INSTRUMENTS CO., LTD. RD-500V Rework Station, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM SPS Solder Paste Mixer and MALCOM Spiral Viscometer.
Industry News | 2015-08-27 13:31:06.0
Seika Machinery will exhibit in Booth #707 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The Seika team will be available to demonstrate the following equipment: DEN-ON INSTRUMENTS CO., LTD. RD-500V Rework Station, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM SPS Solder Paste Mixer and MALCOM Spiral Viscometer.
Industry News | 2016-02-16 18:14:45.0
Seika Machinery will exhibit in Booth #1145 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The Seika team will be available to demonstrate industry-leading equipment from Sayaka, Hioki, SAWA, McDry, Eightech, Unitech, Andes, MALCOM and DENON INSTRUMENTS.
Industry News | 2016-08-30 16:08:53.0
Seika Machinery will exhibit in Booth #506 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Special show floor prices will be offered on the Sawa Handy Cleaner and select McDry products.
Industry News | 2016-12-21 11:15:14.0
Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Industry News | 2016-12-21 11:15:27.0
Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Industry News | 2021-10-07 15:38:24.0
Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."
