Industry News | 2007-12-19 15:13:53.0
OSAKA, JAPAN � December 17, 2007 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present during the 13th Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition that is scheduled to take place January 22-24, 2008 at the Sheraton Kauai Resort, in Kauai, Hawaii.
Industry News | 2008-06-11 18:26:39.0
FINE LINE STENCIL announces Slic Blade™, its newest line of squeegee blades, and a SMT VISION Award winning product.
Industry News | 2010-06-04 17:36:28.0
DENVER — Krayden, Inc., a leading distributor of engineered materials, introduces the Permabond TA459 magnet adhesive that is non-corrosive to electrically conductive surfaces including copper.
Industry News | 2011-01-26 20:33:39.0
Christopher Associates announced today the introduction of Koki’s S01X7C48-M500 High-Reliability Low-Ag Lead-Free Solder Paste. In response to the rise in the cost of metal, particularly silver, Koki has developed a lower cost alternative.
Industry News | 2011-06-07 14:22:50.0
Krayden introduces Dow Corning’s 3145 RTV Silicone Adhesive. The adhesive is available in gray or clear, and is ideal for sealing openings in modules or around electrical wires and leads.
Industry News | 2012-07-25 15:16:14.0
The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference
Industry News | 2013-06-10 12:32:44.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is pleased to announce that its newly developed camera assist automation system will be exhibited in Booth 5971 at the SEMICON West exhibition scheduled to take place on 9-11th July 2013 in San Francisco, Calif.
Industry News | 2014-03-26 08:17:39.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2014 NPI (New Product Introduction) Award in the category of Test and Inspection – Functional Test for its Camera Assist Automatic Bondtesting.
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Industry News | 2014-08-28 11:46:07.0
Nihon Superior Co. Ltd. announces that Keith Sweatman will present the paper titled ”Enhancing the Impact Properties of Tin-Copper and Tin-Copper-Nickel Lead-Free Solders with Trace Additions of Zinc, Indium and Gold” at the upcoming SMTA International exhibition.
