Industry News | 2014-05-22 15:42:29.0
Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.
Industry News | 2014-06-03 13:04:15.0
The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.
Industry News | 2022-01-10 16:55:15.0
The SMTA Capital Chapter Officer team is excited to provide our members with a free technical webinar on "Use of Photonic Soldering to Rework Chip Components" presented by Dr. Vahid Akhavan, Global Application Engineer at NovaCentrix. The presentation will take place on January 20th at 12:00am EST.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Industry News | 2016-12-21 11:15:14.0
Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Industry News | 2016-12-21 11:15:27.0
Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Industry News | 2013-06-10 12:32:44.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is pleased to announce that its newly developed camera assist automation system will be exhibited in Booth 5971 at the SEMICON West exhibition scheduled to take place on 9-11th July 2013 in San Francisco, Calif.
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry News | 2021-08-13 08:37:00.0
Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system to support the testing of electronic components for restricted substances such as lead or tin above specified limits. The system can also verify the coating thickness. Defense base customers often require XRF verification testing of components after components have been processed through lead-free to leaded solder alloy exchange for tin mitigation applications. XRF testing may also be required to verify RoHS compliance of components that have been re-balled or re-processed for lead-free applications. In addition to XRF testing, Circuit Technology Center also supports ionic cleanliness testing, X-ray, Acoustic Microscopy, Solderability, and BGA ball shear testing services.
Industry News | 2016-09-02 03:22:09.0
We present the market leading Condor Sigma W12, equipped with a rotating 13500W 518x513mm heater stage that can uniformly warm up your sample to temperatures up to 175°C. The system is designed for die shear testing on large rectangular glass carriers and 12 inch round carriers, to test glued or solder interconnections on a coating.
