Industry News | 2015-06-11 16:18:49.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #5744 at SEMICON West 2015, scheduled to take place July 14-16, 2015 at the Moscone Center in San Francisco. Nordson DAGE will present the 4800 wafer level Bondtester for the first time in North America.
Industry News | 2015-04-21 15:58:48.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), is pleased to announce that it was awarded a 2015 SMT China Vision Award in the category of Inspection & Testing-Functional Testing for its Camera Assist Automatic Bondtesting. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2016-07-30 19:34:22.0
Nordson DAGE and Nordson MATRIX, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre. Nordson DAGE will showcase its new 4th generation, ultra-high resolution, off-line MXI X-ray system – the Quadra™ 7 and 4000Plus Bondtester. Nordson MATRIX will showcase its high-speed X3 Inline AXI system.
Industry News | 2012-02-23 16:34:02.0
Aegis Software will unveil its exciting new nForce product at APEX 2012. Visitors to the booth will see first-hand how nForce provides users with a simple, yet extremely powerful process assurance solution for best-in-class factories.
Industry News | 2015-04-09 11:23:43.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its market-leading portfolio of Test and Inspection equipment in Booth No. 7A-131 at SMT/Hybrid/Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Industry News | 2015-04-22 14:52:28.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Test Instruments for Camera Assist Automatic Bondtesting on the 4000Plus. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. This is the fourth award for this application.
Industry News | 2014-10-01 13:08:36.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2014 Global Technology Award for its Camera Assist Automatic Bondtesting.
Industry News | 2017-02-28 20:48:10.0
STI Electronics is pleased to announce that it will exhibit at the AUSA Global Force Symposium and Exhibition. The Association of the United States Army Institute of Land Warfare (AUSA ILW) will produce an unclassified Global Force symposium for members of industry and the military community that is scheduled to take place March 13-15, 2017 at the Von Braun Center in Huntsville, AL.
Industry News | 2017-10-17 19:47:15.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Hall A2 Booth 445 at productronica 2017, scheduled to take place Nov. 14-17, 2017 at the Messe München in Germany.
Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
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