Industry News | 2010-04-12 16:09:04.0
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
Industry News | 2018-10-09 14:46:48.0
Kester will be exhibiting (booth #117) at SMTAI 2018, which will take place October 16-17 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2021-07-19 16:31:50.0
Indium Corporation has released TACFlux®571HF, a new no-clean, halogen-free flux formulated for both hand soldering and rework.
Industry News | 2011-08-22 20:19:21.0
KIC announces an opportunity to win an Apple iPad2 by beating its award-winning Auto-Prediction Navigator Profiling Software. All participants will receive a certificate for a free KIC Navigator or Auto-Focus Power upgrade, a $975 value*!
Industry News | 2016-02-03 12:04:47.0
The theme for Seica at Apex this year will be automation and Industry 4.0. Highlights will include the traditional Compact line of bed of nails and functional testers; the Pilot line, a truly versatile and multi-faceted flying probe system; its Mini line of benchtop ATE, and the Firefly line, a premier laser selective soldering system.
Industry News | 2011-04-06 13:13:52.0
Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.
Industry News | 2017-11-29 14:28:56.0
Nordson MARCH announces its new-generation RollVIA™ plasma system, a completely self-contained vacuum plasma system with production-proven, roll-to-roll material handling for flexible printed circuit board (PCB) manufacturing. The new RollVIA incorporates unique vacuum and gas flow technology, new process control technology, updated electrode designs, and superior temperature management with precise control of roll speed, tension, and edge guidance for uniform plasma treatment of substrates as thin as 25 microns. The RollVIA system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during production of PCBs.
Industry News | 2021-11-05 07:35:56.0
Acquisition lays groundwork for a breakthrough: Microchips placement as part of additively manufactured electronics solution
Industry News | 2010-04-16 16:30:20.0
DENVER — Krayden Inc., a leading distributor of engineered adhesive, sealants conformal coating and lead-free solder products, announces the addition of Gary Buckner to the Dallas Fort Worth Area Sales Team.
Industry News | 2019-01-14 19:51:49.0
Finetech will demonstrate the new SMART DESOLDER 01 at the upcoming IPC APEX Conference scheduled for January 29-31 in San Diego (booth #2427).
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