Industry News | 2022-07-31 19:44:07.0
Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for Indium12.8HF, a versatile solder paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.
Industry News | 2019-11-12 12:23:14.0
Seica Automation will be showcasing their latest board handling and process automation solutions at Productronica 2019 in Hall A3, booth 337.
Industry News | 2017-03-07 19:43:06.0
Nordson MARCH has won the 2017 New Product Introduction (NPI) Award in the Surface Treatment Equipment category for its ModVIA™ Plasma Treatment System. The Award, sponsored by Printed Circuit Design and Fab magazine, was presented at a ceremony during IPC APEX 2017, held in San Diego, CA, on February 14, 2017.
Industry News | 2017-01-29 09:37:08.0
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
Industry News | 2008-05-12 19:33:55.0
Based on its recent analysis of the printed circuit board (PCB) markets, Frost & Sullivan recognizes Endicott Interconnect Technologies, Inc. with the North American Frost & Sullivan Award for Growth Excellence of the Year. The Award lauds Endicott for demonstrating excellence in manufacturing, revenue growth; dedication to customer service, and a well executed sales and marketing strategy.
Industry News | 2015-07-01 15:44:06.0
Nordson MARCH, a Nordson company (NASDAQ: NDSN)announces its new SPHERE™ Series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAK™ Series, the new series consists of the TrophoSPHERE™ and StratoSPHERE™ plasma treatment systems. The systems perform descum, ashing (photoresist/polymer stripping), dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Both systems support automated handling and processing of round or square wafers and can process thin wafers with or without a carrier, depending upon the wafer thickness.
Industry News | 2016-09-21 15:33:30.0
Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.
Industry News | 2016-10-11 19:03:14.0
Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.
Industry News | 2010-03-17 19:20:13.0
WOBURN, MA ? Acculogic's Manufacturing Test Systems Division, a global leader in electronics test and production solutions, announces that the advances in limited testing seminar has been changed from Tuesday, March 23 to Tuesday, April 27, 2010. The time and location will remain the same: 8:30-11:30 a.m. at the Crowne Plaza Hotel in Newton, MA. Also, the second seminar, originally scheduled to take place on Wednesday, March 24, 2010 from 8:30-11:30 a.m. at the Hampton Inn in Farmington, CT has been cancelled.
Industry News | 2015-08-20 08:37:19.0
Nordson MARCH announces that its StratoSPHERE™ Series plasma treatment equipment for wafer-level packaging and 3D packaging applications can now be configured in two, four, and even six chamber configurations for increased throughput and flexibility. The SPHERE™ plasma systems provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations, especially for applications such as 2.5D and 3D wafer-level fan-out.
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