Industry News | 2010-05-12 13:12:33.0
Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
Industry News | 2017-11-10 17:38:29.0
Saki Corporation announces that it will introduce its new 3Di Automated Optical Inspection (AOI) systems at Productronica, stand A2.259. The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3Ơ), height repeatability (below 2µm at 3Ơ), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg.
Industry News | 2021-06-28 14:20:18.0
Vishay Siliconix MOSFET Delivers High Power Density and Efficiency; Provides On-resistance of 1.5mΩ at 4.5V
Industry News | 2023-05-25 10:58:22.0
ARIES Embedded Launches a 'Community-Flavor-Board' for Quick Project Entry and Fast Prototyping Based on OSM-compatible MSRZFive SiP with RZ/Five Microprocessor from Renesas
Industry News | 2023-09-25 20:04:34.0
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.
Industry News | 2009-10-13 16:29:26.0
MADISON, AL — October 2009 — STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Jim D. Raby, P.E. held a successful presentation at SMTA International. The presentation was held during session ET3 titled, “System in Packaging (SiP),” which took place Monday, October 5, 2009 from 1-2:30 p.m. in the California room at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2011-06-01 23:22:00.0
Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.
Industry News | 2014-02-19 16:03:57.0
Nihon Superior Co. Ltd Nihon Superior will exhibit in Booth #2353 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2015-01-19 21:20:27.0
Nihon Superior Co. will exhibit in Booth #739 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will showcase the SN100C P506 D4 lead-free, no-clean solder paste and Alconano Nano-Silver paste.
Industry News | 2015-01-27 10:29:53.0
Nihon Superior recently exhibited at NEPCON Japan at the Tokyo Big Sight in Japan. The company had a successful show with high interest in its newly developed products and several new technologies.
