Industry News | 2018-03-13 16:34:13.0
NEO Tech announces that it recently produced and published new and expanded guidelines for the manufacture of Low-Temperature Co-fired Ceramic (LTCC) and Aluminum Nitride (AlN) packaging solutions.
Industry News | 2020-10-29 07:43:21.0
Indium Corporation earned Electronics Maker's Best of Industry Award for 'Excellence in Electronics Assembly Materials' on Thursday, October 15 during a virtual ceremony.
Industry News | 2021-12-20 04:12:01.0
2021 China South China SMT Academic and Applied Technology Seminar and China SMT Innovation Achievement Award Ceremony was held in Shenzhen on December 10. In order to build a good communication platform for SMT enterprises in South China and create opportunities for technical exchange, the SMT Academic and Application Technology annual meeting in South China is held every December by the SMT Special Committee of Guangdong Electronics Society. This annual meeting invited industry experts to explain the innovation direction of intelligent manufacturing SMT technology and SiP packaging, from PCBA to micro assembly, to solve the hot issues of high-density, thin and miniaturization of electronic products, especially mobile terminal electronic products in recent years.
Industry News | 2023-06-28 11:01:03.0
Expanded Ecosystem Serves Customers with Optimized Support and Accelerated Time-to-Market
Industry News | 2023-07-03 20:00:15.0
Expanded Ecosystem Serves Customers with Optimized Support and Accelerated Time-to-Market
Industry News | 2003-07-08 09:38:05.0
The RocketIO Design Kit for HyperLynx ensures system design companies reach their time-to-market goals
Industry News | 2007-07-26 16:51:57.0
New improved facility boasts many improvements for enhanced production / service
Industry News | 2010-04-12 01:51:10.0
Universal Instruments expands its proven Genesis Platform portfolio with the introduction of the GenesisSC Platform – a revolutionary Semiconductor solution that blends state-of-the-art flip chip assembly capabilities with the robustness and speed of the Genesis Platform.
Industry News | 2015-08-10 05:04:49.0
ELCOSINT collaborative R&D project has focussed on high temperature electronics. Over the last 3 years the project partners Microsemi, Gwent Electronic Materials(GEM) and National Physical Laboratory (NPL) have successfully developed materials specifically designed to offer an alternative for high Pb content materials to further increase the operating temperature of electronic assemblies.
Industry News | 2024-02-26 14:00:02.0
High-performance memory supplier chooses Saki's 3Si solder-paste inspection and 3Di inline AOI systems to handle miniaturization challenges and prepare for smart manufacturing.
