Industry News | 2011-10-21 13:55:23.0
IPC’s Solder Products Value Council (SPVC) is actively urging tin smelters to become smelters of conflict-free minerals and recommends the Electronic Industry Citizenship Coalition/Global e-Sustainability Initiative (EICC/GESI) Conflict-Free Smelter (CFS) program.
Industry News | 2011-12-07 20:51:57.0
IPC announces the creation of a new IPC Printed Electronics Management Council Steering Committee that will oversee the development of educational programs to support the printed electronics industry.
Industry News | 2012-01-22 23:01:12.0
To assist the industry in understanding the conflict minerals legislation set forth in Section 1502 of the Dodd-Frank Act and, more importantly, preparing to comply with the pending regulation, IPC APEX EXPO® will offer updates for the electronics manufacturing supply chain. Executive-level briefings, expert-panel discussions of new developments and industry compliance strategies, development of industry guidance documents and standards as well as an update on IPC’s continued lobbying efforts are designed to help industry companies fully comprehend the impact of the conflict minerals requirements.
Industry News | 2013-05-06 18:48:35.0
IPC – Association Connecting Electronics Industries® announces an ambitious technical agenda for the IPC/FED Conference on Embedded Components.
Industry News | 2023-07-19 10:18:06.0
IPC China Skills Competition has been upgraded to IPC Masters Competition China 2023. The competition was co-organized with Pudong New Area Association for Quality and Technology Shanghai and held July 11-13 in Shanghai.
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2005-11-29 11:31:48.0
New Siliconix Power MOSFETs in Thermally Enhanced PowerPAK 1212-8 Package Combine 3.3 mm by 3.3 mm Footprint, Thermal Resistance of Less Than 2 Degrees Celsius Per Watt, and On-Resistance Values Down to 3.7 Milliohms
Industry News | 2021-03-09 16:28:04.0
Upgraded VRPower® Smart Power Stages Increase Efficiency and Accuracy to Support the Latest Generation of Microprocessors
Industry News | 2013-11-28 07:37:50.0
The split output topology negates the limitations of the SiC MOSFET.
Industry News | 2005-01-31 15:06:35.0
The new SiP41103, SiP41104, and SiP41105 dual MOSFET drivers, which drive both the lower and upper MOSFETs in a half-bridge configuration, work in systems with supply voltages from 4.5 V up to 50 V.
