Industry News | 2005-01-05 12:31:32.0
New terminator ICs serve as pin- and function-compatible, lead (Pb)-free replacements for the industry-standard UCC56xx series of SCSI terminators.
Industry News | 2005-11-29 11:38:06.0
New Vishay Siliconix Synchronous Buck Step-Down Controller ICs Handle 10-A Currents, Provide Industry-Low Outputs to 0.6 V With 93% Efficiency
Industry News | 2009-11-01 18:08:20.0
SIPLACE SiCluster Professional is the latest software tool in the family of proven SIPLACE setup optimization systems. It groups components and uses this information to propose optimized setups. The highlight of the new version: for a fixed product spectrum, the software defines so-called constant tables which remain unchanged and in the same position at the placement machine for the entire setup family.
Industry News | 2005-12-06 14:46:13.0
Compact Package Options Enable High Efficiency and Space Savings in Portable Electronics
Industry News | 2022-04-28 14:14:09.0
Indium Corporation®'s Leo Hu, senior area technical manager – East China, will share the challenges and solutions of fine feature solder paste printing for system-in-package (SiP) at SiP Conference China, May 19, Shanghai, China.
Industry News | 2009-05-26 21:19:22.0
Solothurn, Switzerland � May 2009 - JUKI, a world-leading provider of automated assembly products and systems, announces SiMS' investment in the FX-3, Juki's newest high-speed chip shooter.
Industry News | 2023-03-24 09:23:31.0
ViTrox, which aims to be the world's most trusted technology company, is excited to announce the launch of the enhanced Tray-based Vision Handler, TR1000S⁺i!
Industry News | 2003-06-30 17:15:36.0
New power MOSFETs built on a breakthrough TrenchFET� technology that combine greatly reduced switching losses with ultra-low on-resistance were announced by Siliconix incorporated.
Industry News | 2022-07-19 13:31:23.0
New OSM-compatible SiP Integrates ST Microelectronics' STM32MP1 MPU with Arm CortexA7/M4 for Industrial and IoT Applications
Industry News | 2004-05-24 17:45:54.0
The new devices are designed for low-side operation in synchronous buck (single- and multi-phase configurations) dc to dc converters.
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