Industry News: si- (Page 8 of 27)

Setup with SIPLACE SiCluster Professional

Industry News | 2009-12-14 08:52:30.0

More efficient setups lead to higher productivity

Siemens Process Industries and Drives

Viscom Introduces New AOI Features with SI Software Release 7.45

Industry News | 2012-04-26 14:34:00.0

With its software, Viscom offers many useful additional features to make using AOI/AXI inspection systems in electronics manufacturing faster and more convenient.

Martel Marketing Communications, Inc.

Viscom SI Release 7.46 – more performance for Viscom 3-D SPI, AOI and AXI

Industry News | 2013-06-18 09:01:53.0

With the Software Release SI 7.46, the developers at Viscom have integrated many new functionalities that further increase the performance capability of its inspection systems.

Viscom AG

Indium Corporation to Feature Products for HIA and SiP at IMAPS Boston

Industry News | 2022-09-19 05:59:24.0

Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.

Indium Corporation

Heraeus Electronics Joins EU-Funded Project FastLane to Accelerate Future of Sustainable Power Electronics

Industry News | 2024-06-24 09:27:29.0

Heraeus Electronics is proud to announce its participation in the FastLane project, an ambitious EU-funded initiative aimed at revolutionizing the European value chain for Silicon Carbide (SiC)-based power electronics. This project, led by Valeo France, spans 36 months, from May 1, 2024, to April 30, 2027.

Heraeus

Heraeus Electronics Announces Global Launch of Condura®.ultra Ag Si3N4 free AMB Substrate at PCIM Europe

Industry News | 2022-05-18 12:32:37.0

Heraeus Electronics today announced the launch of its new Condura®.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.

Heraeus

Cotco�s New TBL Blue LEDs Maximize Light Extraction Efficiency

Industry News | 2005-02-24 11:44:09.0

TBL Blues are Exclusively Avaialble from Marktech Optoelectronics

Marktech Optoelectronics

Indium Corporation's Lim to Present at SEMICON China

Industry News | 2016-03-03 10:33:15.0

Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim's presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.

Indium Corporation

Libra Industries Appoints Senior Director of Operations at Libra – Dayton SI

Industry News | 2021-04-29 16:36:20.0

Libra Industries has named Bruce Parisey Senior Director of Operations of Libra Dayton SI.

Libra Industries, Inc.

Vishay Launches 240-Milliohm, 200-V Switching MOSFET in 3.3-mm by 3.3-mm PowerPAK� 1212-8

Industry News | 2004-05-24 17:35:44.0

Si7820DN�s Small Size and High Power Capability Are Essential to Implementation of New Sub-Brick DC/DC Power Architectures

Vishay Intertechnology, Inc.


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