Industry News | 2023-12-11 12:38:49.0
Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on the application of new soldering thermal interface materials (TIMs) in advanced packaging at SiP China Conference 2023 on December 13 in Shanghai.
Industry News | 2002-05-07 09:13:04.0
Launched to Serve the Mixed-signal and RF Semiconductor Segments
Industry News | 2006-02-02 15:08:36.0
Dicing saw blades for dicing Si, ceramics, and most III-V materials are now available from Keteca USA in Phoenix Arizona.
Industry News | 2008-06-12 21:49:07.0
ScanWorks� integration into Cadence Encounter Digital IC Design Flow to provide deeper view into complex, packaged chips
Industry News | 2011-02-05 13:55:42.0
The International PV Equipment Association (IPVEA) announces that it is now seeking speakers for the PV Production Forum 2011 at the 26th EU PVSEC in Hamburg, Germany. The conference will take place over five days from 5-9 September 2011.
Industry News | 2014-01-07 18:34:43.0
Nihon Superior Co. Ltd. announced that it will exhibit in EAST 3-27 at the upcoming INTERNEPCON 2014, scheduled to take place January 15-17, 2014 at the TOKYO BIG SITE in Tokyo, Japan.
Industry News | 2021-07-02 04:06:41.0
Laserssel Co., LTD is pleased to introduce its rLSR Mini LED Rework System. The revolutionary soldering technique enables the industry to solder temperature sensitive, warpage prone, very fine-pitch, odd form, big die, SiP, wearables, flex to flex, and various other mainstream and niche applications defect-free, high yield and with a low cost of ownership.
Industry News | 2003-06-11 13:37:07.0
With efficiencies better or comparable to competing implementations in the MLF/QFN/Power Block packages, these new devices in the LITTLE FOOT SO 16 feature a 38% or smaller standard footprint, simplifying design, assembly, soldering, and layout.
Industry News | 2021-03-30 11:44:23.0
Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15.
Industry News | 2009-09-17 14:35:25.0
MADISON, AL — September 2009 — STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Jim D. Raby, P.E., Mark McMeen, V.P. of Engineering Services, and Casey H. Cooper, Electrical Engineering Manager will give a presentation titled “Imbedded Die Assembly Process, Is It Ready Yet?” at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session ET3 titled, “System in Packaging (SiP), which is scheduled to take place Monday, October 5, 2009 from 1-2:30 p.m. in the California room.
