Industry News | 2010-08-17 11:50:19.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its newly redesigned series of Siemens ceramic replacement nozzles.
Industry News | 2010-05-11 11:59:56.0
GAINESVILLE, GA - Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its new series of custom SMT pick-and-place nozzles for CREE® LED components. This new series is manufacturer-approved, based on CREE Inc.'s strict requirements and specifications.
Industry News | 2011-01-31 22:13:54.0
Count On Tools Inc. introduces its new series of Custom SMT Pick-and-Place Nozzles for CREE® XLamp® XM-L LED components. The new series is manufacturer-approved, based on CREE Inc.’s strict requirements and specifications.
Industry News | 2011-02-07 15:28:03.0
Count On Tools Inc. introduces its new series of Custom SMT Pick-and-Place Nozzles for 0201 and 01005 Micro-Components. By working closely with a component manufacturer and leading EMS companies, Count On Tools guarantees secure picking of all fragile micro-components and accurate placement on the circuit board.
Industry News | 2006-02-23 10:25:26.0
The placement machine platform from Siemens Electronics Assembly Systems - the SIPLACE X-Series - was recognized by SMT magazine for innovation and excellence at the APEX/IPC Printed Circuits Expo.
Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
Industry News | 2009-05-29 12:27:20.0
Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.
Industry News | 2009-01-30 18:39:51.0
S-series tape feeders have been one of the most important components of many Siplace placement machines for many years. With its new 3x8 mm shutterless S-feeder, Siemens Electronics Assembly Systems (SEAS) now presents another improved version in the series. Fewer movable parts mean longer life and more reliability. The new feeder also handles a broader spectrum of components and makes the user's job easier. As a special benefit, owners of classic 3x8 mm feeders can have them upgraded to the shutterless version.
Industry News | 2009-03-19 15:44:30.0
With its SIPLACE MultiStar, Siemens Electronics Assembly Systems presents the world's first placement head that automatically adapts to nearly all requirements and products in electronics manufacturing. By using different placement modes, the SIPLACE MultiStar balances production lines automatically. It is the first head that combines the speed of Collect & Place operation for small components (01005 and larger) with the versatility of Pick & Place operation for larger components (up to 50 x 40 mm).
Industry News | 2011-06-09 13:47:08.0
Cognex Corporation announces a new option to deliver its VisionView® operator interface to third-party CE Panels. VisionView CE software can now be licensed and installed directly onto Rockwell and Siemens CE panels, allowing end users to use existing equipment and reduce monitor clutter.
