Industry News: siemens hs50 head (Page 1 of 6)

New head of SIPLACE product marketing

Industry News | 2009-03-19 15:52:21.0

Bernhard Fritz, 39, is the new head of product marketing at Siemens Electronics Assembly Systems GmbH & Ko. KG (SEAS). Fritz succeeds Holger Liebetruth, who is taking on other assignments within strategic marketing at Siemens AG.

Siemens Process Industries and Drives

SIPLACE MultiStar CPP head ensures optimally balanced production lines

Industry News | 2009-03-19 15:44:30.0

With its SIPLACE MultiStar, Siemens Electronics Assembly Systems presents the world's first placement head that automatically adapts to nearly all requirements and products in electronics manufacturing. By using different placement modes, the SIPLACE MultiStar balances production lines automatically. It is the first head that combines the speed of Collect & Place operation for small components (01005 and larger) with the versatility of Pick & Place operation for larger components (up to 50 x 40 mm).

Siemens Process Industries and Drives

Interview with Ray Bruce, head of the global SIPLACE CRM organization

Industry News | 2010-05-11 15:39:58.0

"Emerging from the crisis with innovations and build-to-order" The signs of a recovery in electronics manufacturing are intensifying. For Ray Bruce, head of the global SIPLACE CRM organization, and his team, the goal is now to arrive at the right short-term and medium-term conclusions from the changes. Bruce also believes that manufacturers are now called upon to develop and support new production concepts.

Siemens Process Industries and Drives

Cogiscan Partners with Siemens PLM Software to Provide a Complete Industry 4.0 Solution for Electronics Manufacturing

Industry News | 2016-10-11 19:39:18.0

Cogiscan Inc.is partnering with Siemens PLM Software to provide a complete manufacturing software solution to enable Industry 4.0 for Electronic Manufacturers.

Cogiscan Inc.

Siemens Launches SIPLACE SX Road Show

Industry News | 2009-08-26 08:32:37.0

SIPLACE SX goes on the road in the Americas

Siemens Process Industries and Drives

NEW � SIPLACE X-Series Powered by SIPLACE CPP MultiStar

Industry News | 2009-03-10 00:30:31.0

Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.

ASM Assembly Systems GmbH & Co. KG

Siemens SIPLACE X-Series Wins Vision Award

Industry News | 2006-02-23 10:25:26.0

The placement machine platform from Siemens Electronics Assembly Systems - the SIPLACE X-Series - was recognized by SMT magazine for innovation and excellence at the APEX/IPC Printed Circuits Expo.

ASM Assembly Systems GmbH & Co. KG

The SIPLACE SX Road Show Begins

Industry News | 2009-09-16 12:10:33.0

Live Gantry Upgrade at World Record Speed

Siemens Process Industries and Drives

Siemens New Product Preview APEX 2008 � Booth #2359

Industry News | 2008-03-04 12:14:09.0

SIPLACE X4i � Siemens placement machine with the world�s fastest throughput

Siemens Process Industries and Drives

Siegfried Neubauer returns to SIPLACE headquarters

Industry News | 2010-06-23 11:30:04.0

After more than seven years, SIPLACE head of Asian operations Siegfried Neubauer (46) returns to the headquarters of Siemens Electronics Assembly Systems GmbH & Co. KG (SEAS) in Munich.

Siemens Process Industries and Drives

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