Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2013-08-22 12:55:43.0
A leading auction agency has announced it will be hosting an online exchange auction of used equipment utilized in the electronics manufacturing industry. The auction opens on Tuesday, August 27, 2013 at 8:00am EST and begins closing on Thursday, August 29, 2013 at 11:00am EST.
Industry News | 2013-05-01 12:45:51.0
Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht
Industry News | 2013-03-29 11:49:19.0
IPC — Association Connecting Electronics Industries® announces the appointment of industry veteran Randy Cherry as director of its new validation business unit.
Industry News | 2013-01-28 07:29:00.0
IPC APEX EXPO® debut new products and services
Industry News | 2013-03-19 15:13:22.0
Dr. Choon Lee, senior vice president, Amkor Technology, and a leading expert and innovator in the field of packaging technology, will reveal their strengths and weaknesses during his keynote, “System Integration Challenges in Packaging,” at IPC Electronic System Technologies Conference & Exhibition (ESTC), on May 22, 2013.
Industry News | 2010-07-16 15:39:24.0
To assist international electronics assembly suppliers in reaching the rapidly growing Central and Eastern European electronics market, IPC — Association Connecting Electronics Industries® will host the IPC Electronics Assembly Quality & Reliability Conference and table top exhibition. The event, supported by the National Electronics Society of Hungary, will be held 6–7 October 2010, in Budapest, Hungary.
Industry News | 2013-03-12 13:42:20.0
With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment.
Industry News | 2013-04-30 11:55:39.0
Pickering Interfaces has continued in 2013 to regularly release a steady flow of new products in both the LXI and PXI platforms. We would like to highlight the launch of new products at Automotive Testing Expo Stuttgart this year.
Industry News | 2013-10-22 16:48:14.0
Europlacer will exhibit the ii-Feed in Hall A2, Booth #439 at the productronica International Trade Fair, scheduled to take place November 12-15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
