Industry News | 2009-01-30 18:37:44.0
Siemens Electronics Assembly Systems (SEAS), which has been a separate company since the start of the year, wants to further expand its global Siplace technology expertise network. By entering into additional cooperative agreements with other technology suppliers, SEAS wants to be able to offer their shared customers coordinated manufacturing solutions. SEAS believes that this optimized interaction between SMT equipment manufacturers will take advantage of significant, currently unused efficiency and productivity potentials in electronics production.
Industry News | 2010-01-22 21:20:50.0
DEK recently encouraged its customers to become ‘de-DEK-tives’ in order to triumph in a prize draw held on its stand at Munich’s Productronica exhibition. Having now revealed the competition winner as Siemens AG’s Mr. Stanek, DEK has successfully drawn attention to the critical nature of stencil design in relation to ongoing product reliability – with a little help from Sherlock Holmes and Dr. Watson.
Industry News | 2010-06-18 07:44:16.0
New SIPLACE Operations Information Broker (OIB)
Industry News | 2019-01-03 19:50:40.0
KIC announces a technology collaboration with Mentor, a Siemens Business, leveraging KIC’s professional knowledge on thermal processes and Mentor’s comprehensive expertise on surface mount technology (SMT) manufacturing towards Industry 4.0. This cooperation utilizes KIC’s smart oven technology to provide process transparency, traceability, consistent quality and reduced costs through a new level of automation for their mutual customers.
Industry News | 2012-07-13 07:31:28.0
Low-cost tablet PC manufactured with State-of-the-art SIPLACE placement solutions
Industry News | 2009-03-19 15:44:30.0
With its SIPLACE MultiStar, Siemens Electronics Assembly Systems presents the world's first placement head that automatically adapts to nearly all requirements and products in electronics manufacturing. By using different placement modes, the SIPLACE MultiStar balances production lines automatically. It is the first head that combines the speed of Collect & Place operation for small components (01005 and larger) with the versatility of Pick & Place operation for larger components (up to 50 x 40 mm).
Industry News | 2009-03-19 15:46:52.0
After the successful carve-out of Siemens Electronics Assembly Systems (SEAS), SIPLACE surprises its customers and other electronics production experts now with a new Internet presence. The www.siplace.com website was overhauled from the ground up.
Industry News | 2009-03-19 15:50:39.0
Huawei Technologies Co. is starting the second phase of its extensive investment program. Part of this expansion program, which was initiated in 2008, is the company's investment in further SIPLACE production lines. On Feb. 27, 2009, representatives of Huawei Technologies Co and Siemens Electronics Assembly Systems finalized the plans for an additional $6.8 million worth of SIPLACE equipment as a follow-up deal to the SIPLACE placement systems installed at the beginning of the year.
Industry News | 2009-05-29 12:27:20.0
Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.
Industry News | 2009-12-07 13:42:08.0
To expand its sales and service activities in Turkey, the global SIPLACE team has selected C3Teknoloji, a strong partner with lots of experience in the region.
