Industry News: siemens siemens hs-50/60 (Page 8 of 26)

SIPLACE MultiStar CPP head ensures optimally balanced production lines

Industry News | 2009-03-19 15:44:30.0

With its SIPLACE MultiStar, Siemens Electronics Assembly Systems presents the world's first placement head that automatically adapts to nearly all requirements and products in electronics manufacturing. By using different placement modes, the SIPLACE MultiStar balances production lines automatically. It is the first head that combines the speed of Collect & Place operation for small components (01005 and larger) with the versatility of Pick & Place operation for larger components (up to 50 x 40 mm).

Siemens Process Industries and Drives

New SIPLACE Internet presence goes online

Industry News | 2009-03-19 15:46:52.0

After the successful carve-out of Siemens Electronics Assembly Systems (SEAS), SIPLACE surprises its customers and other electronics production experts now with a new Internet presence. The www.siplace.com website was overhauled from the ground up.

Siemens Process Industries and Drives

Huawei commits to SIPLACE Placement Systems

Industry News | 2009-03-19 15:50:39.0

Huawei Technologies Co. is starting the second phase of its extensive investment program. Part of this expansion program, which was initiated in 2008, is the company's investment in further SIPLACE production lines. On Feb. 27, 2009, representatives of Huawei Technologies Co and Siemens Electronics Assembly Systems finalized the plans for an additional $6.8 million worth of SIPLACE equipment as a follow-up deal to the SIPLACE placement systems installed at the beginning of the year.

Siemens Process Industries and Drives

New development from the SIPLACE Technology Network - The new SIPLACE CA application: Die-bonding and SMD placement in a single machine

Industry News | 2009-05-29 12:27:20.0

Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.

Siemens Process Industries and Drives

C3Teknoloji named new SIPLACE sales partner in Turkey

Industry News | 2009-12-07 13:42:08.0

To expand its sales and service activities in Turkey, the global SIPLACE team has selected C3Teknoloji, a strong partner with lots of experience in the region.

Siemens Process Industries and Drives

We are supplier of IC chip, Electronic components and other electrical equipment from Shenzhen Fuwo technology Co.,Ltd.

Industry News | 2021-07-26 23:40:42.0

Shenzhen Fuwo Technology Co., Ltd. Our main product brands include semicolon, infinitely, Mitsubishi, Fuji, Hitachi, Siemens, Sanyo, ABB, PRX, IR, IP, TDK, POWER-ONE, AEG, NEC, APT, ST, TI, AD, ST, AVX, ALTERA, Seattle, IXYS, MICRON, MXIC, SPANSION, ROHM, VISHAY, diode, AVAGO, IDT, POWER, IR, Linear, Winbond, GENNUM, SHARP, ATM, TOSHIBA, ADI, ON, MAX, NXP, INTERSIL ...... If you have any need or inquires, please feel free to contact us, and we can also provide BOM and samples. We hope can do business relationship with you. Sincerely yours, Leeta E: sale1@fuwo-techonology.com Whatsapp/skype: 86 18802689860

Shenzhen Fuwo Technology Co.,Ltd

Bonding Coverlens Touchsensor Fronts - Innovative plant technology to speed up the manufacturing process

Industry News | 2022-01-05 08:35:52.0

Following the everyday operating habits of smartphones and tablets, the control units of industrial plants are now equipped with touch screens. The Siemens plant in Amberg is a multiple award-winning location where around 5,000 employees manufacture Simatic and Sirius products for the automation industry using state-of-the-art production technology. This also includes operating and monitoring devices for industrial applications in logistics and mechanical engineering. In line with its claim to be an innovation location, the site decided to install a Scheugenpflug dispensing system to bond Coverlens Sensor Fronts for industrial plant control displays.

Scheugenpflug Inc.

Setup with SIPLACE SiCluster Professional: More efficient setups lead to higher productivity

Industry News | 2009-12-05 18:07:02.0

With its SIPLACE SiCluster Professional optimization software, Siemens Electronics Assembly Systems GmbH & Co.KG (SEAS) expands its wide-ranging portfolio of intelligent setup strategies for electronics manufacturing. In addition to combining products into setup families (clusters), SIPLACE SiCluster Professional is the first program that determines any component overlaps in these family setups. It groups these shared components on "constant component tables", which remain on the machine during setup changeovers, thus saving a significant amount of time.

Siemens Process Industries and Drives

SIPLACE Operations Information Broker (OIB): Efficient software integration across the entire SMT process chain

Industry News | 2010-03-10 15:51:40.0

The new version of its SIPLACE OIB (Operations Information Broker), Siemens Electronics Assembly System (SEAS) now offers an optimized multi-vendor integration platform for electronics production.

Siemens Process Industries and Drives

SIPLACE 3x8 mm shutterless S-feeder improves component supply

Industry News | 2009-01-30 18:39:51.0

S-series tape feeders have been one of the most important components of many Siplace placement machines for many years. With its new 3x8 mm shutterless S-feeder, Siemens Electronics Assembly Systems (SEAS) now presents another improved version in the series. Fewer movable parts mean longer life and more reliability. The new feeder also handles a broader spectrum of components and makes the user's job easier. As a special benefit, owners of classic 3x8 mm feeders can have them upgraded to the shutterless version.

Siemens Process Industries and Drives


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