Industry News | 2014-03-07 15:01:40.0
Bajabid.com will be conducting an online SMT Exchange Auction. This event will include a wide variety of electronic manufacturing & assembly equipment from several sellers sites located at different sites around the United States.
Industry News | 2014-03-19 15:09:03.0
BajaBid will be completing its latest online SMT Exchange Auction tomorrow [Thursday 3/20/14]. This event will include a wide variety of electronic manufacturing & assembly equipment from several sellers located at different sites around the United States.
Industry News | 2013-08-22 12:55:43.0
A leading auction agency has announced it will be hosting an online exchange auction of used equipment utilized in the electronics manufacturing industry. The auction opens on Tuesday, August 27, 2013 at 8:00am EST and begins closing on Thursday, August 29, 2013 at 11:00am EST.
Industry News | 2013-08-27 13:14:25.0
Baja Bid, a leading host for online SMT exchange auction events, is kicking off another sale of used SMT, assembly, and remanufactured SMT equipment.
Industry News | 2010-08-17 11:50:19.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its newly redesigned series of Siemens ceramic replacement nozzles.
Industry News | 2012-01-13 13:27:59.0
The SMT stencil market has a slew of new options in foil materials, coatings and cutting technologies, all of which promise to improve the solder paste printing process. Which of these options really do help assemblers keep yields up and costs down, and which don’t?
Industry News | 2013-05-01 12:45:51.0
Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht
Industry News | 2006-02-23 10:25:26.0
The placement machine platform from Siemens Electronics Assembly Systems - the SIPLACE X-Series - was recognized by SMT magazine for innovation and excellence at the APEX/IPC Printed Circuits Expo.
Industry News | 2008-03-04 12:14:09.0
SIPLACE X4i � Siemens placement machine with the world�s fastest throughput
Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
