Industry News | 2009-03-19 15:44:30.0
With its SIPLACE MultiStar, Siemens Electronics Assembly Systems presents the world's first placement head that automatically adapts to nearly all requirements and products in electronics manufacturing. By using different placement modes, the SIPLACE MultiStar balances production lines automatically. It is the first head that combines the speed of Collect & Place operation for small components (01005 and larger) with the versatility of Pick & Place operation for larger components (up to 50 x 40 mm).
Industry News | 2009-03-19 15:52:21.0
Bernhard Fritz, 39, is the new head of product marketing at Siemens Electronics Assembly Systems GmbH & Ko. KG (SEAS). Fritz succeeds Holger Liebetruth, who is taking on other assignments within strategic marketing at Siemens AG.
Industry News | 2010-05-11 15:39:58.0
"Emerging from the crisis with innovations and build-to-order" The signs of a recovery in electronics manufacturing are intensifying. For Ray Bruce, head of the global SIPLACE CRM organization, and his team, the goal is now to arrive at the right short-term and medium-term conclusions from the changes. Bruce also believes that manufacturers are now called upon to develop and support new production concepts.
Industry News | 2009-05-29 12:32:19.0
SIPLACE reference lines equipped with the new MultiStar CPP head deliver a continuous high level of line productivity, especially in high-mix production environments.
Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
Industry News | 2006-02-23 10:25:26.0
The placement machine platform from Siemens Electronics Assembly Systems - the SIPLACE X-Series - was recognized by SMT magazine for innovation and excellence at the APEX/IPC Printed Circuits Expo.
Industry News | 2009-05-06 14:53:51.0
With the SIPLACE SX, Munich-based technology leader Siemens Electronics Assembly Systems (SEAS) introduces a placement machine that opens the door to totally new manufacturing concepts and delivers significantly more efficiency in response to increasingly frequent product changeovers and massive demand fluctuations.
Industry News | 2010-04-29 08:33:15.0
SIPLACE CA combines die-bonding and SMT placement to meet current trends in packaging of integrated circuits
Industry News | 2009-05-29 12:27:20.0
Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.
Industry News | 2016-10-11 19:39:18.0
Cogiscan Inc.is partnering with Siemens PLM Software to provide a complete manufacturing software solution to enable Industry 4.0 for Electronic Manufacturers.
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