Industry News: silicone (Page 4 of 90)

Global Leader in Inspection Technology to Present at the California Reliability Workshops

Industry News | 2016-05-31 22:02:28.0

MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce its sponsorship and participation in the Northern and Southern California Reliability Workshops. The Northern CA workshop is scheduled to take place Thursday, June 9th at the Embassy Suites by Hilton Milpitas Silicon Valley. The Southern CA workshop will take place Tuesday, June 7th at the Green Dragon Tavern and Museum in Carlsbad, CA. Brian D’Amico will present “The Electronics Manufacturing Industry Requirement for 2D and 3D Inspection Technology.”

MIRTEC Corp

Easier Dispensing for Thermal Sealant

Industry News | 2003-02-24 09:32:24.0

Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.

SMTnet

Noncontact Switching Comes to Confined Spaces

Industry News | 2003-03-26 08:25:40.0

The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.

SMTnet

Desktop Systems Provide Flexible Bonding

Industry News | 2003-06-10 08:39:25.0

New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.

SMTnet

Stencils Optimise Paste Release

Industry News | 2003-03-21 08:12:24.0

Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.

SMTnet

University Pioneers Assembly Technolology

Industry News | 2003-03-28 08:24:43.0

The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.

SMTnet

System Takes on Two-Component Gel Application

Industry News | 2003-04-28 08:12:02.0

The Micro-Meter 2 is an air-operated positive-displacement single-acting two-component system, designed to meter, mix and dispense small 'shots', or beads, of reactive materials.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Register for the World's Largest Event for Medical Device Manufacturing

Industry News | 2003-05-08 07:22:00.0

Over 400 contract manufacturers present every aspect of outsource capability.

SMTnet


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