Industry News | 2013-11-26 14:46:08.0
The 2013 International Wafer-Level Packaging Conference (IWLPC), organized by SMTA and Chip Scale Review magazine, celebrated its 10th consecutive annual event on November 5-7, 2013 with a very successful conference and exhibition. Technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days.
Industry News | 2015-08-20 08:26:34.0
Today, Congressman Mike Honda (D-Silicon Valley) met with executives and employees of IPC-member company Juki Automation Systems at the company’s facility in Fremont, Calif. Coordinated by IPC, the world’s leading association for electronics manufacturing companies, this visit is part of a nationwide effort to educate policymakers about legislative and regulatory issues that affect the electronics manufacturing industry.
Industry News | 2015-09-16 11:15:59.0
Nordson ASYMTEK introduces the NexJet® NJ-8 System which improves and simplifies the dispensing process for fast-paced production environments where precision, flexibility, and long-term reliability are important. The NJ-8's ReadiSet™ 2-piece jet cartridge is quickly and easily removed, cleaned, inspected, and re-installed without tools, maximizing equipment utilization and up-time. The NexJet system is an integral part of Nordson ASYMTEK's comprehensive closed-loop dispensing systems and fully-integrated software-control of the precision jet dispensing process.
Industry News | 2016-05-17 18:32:00.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), was named the winner of SMT China's 2016 Vision Award in the dispensing category for its NexJet® NJ-8 with the ReadiSet™ jet cartridge. The Vision Awards recognizes companies for their remarkable achievements in China's electronics manufacturing industry. The Award was presented at NEPCON China, held April 26-28, 2016 in Shanghai, China.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2018-09-17 19:08:00.0
Sixty-six percent of manufacturing companies say that their leadership does not have a clear vision for the digital future. As manufacturing moves toward the Smart Factory and Industry 4.0, IPC and i4.0 Today will offer members of the electronics industry an opportunity to learn about the technology and future surrounding Industry 4.0 with a two-day i4.0 Connect Forum, to take place in Silicon Valley, Calif., November 6-7.
Industry News | 2023-03-16 14:59:50.0
The success of the CHIPS for America program depends on establishing a U.S. pilot facility for manufacturing integrated circuit (IC) substrates; and getting it done sooner, incrementally, is better than doing it perfectly, according to a new industry report.
Industry News | 2023-04-03 13:24:06.0
IPC welcomes the action of U.S. President Joe Biden today in issuing a "presidential determination" that prioritizes the domestic development of printed circuit boards (PCBs) and advanced packaging, including IC substrates, under Title III of the Defense Production Act (DPA).
Industry News | 2024-06-17 12:34:59.0
Key segments of EU electronics manufacturing industry set to decline undermining Europe's security, industrial resiliency, and global competitiveness
Surface Mount Technology Association (SMTA)
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