Industry News: silver immersion (Page 1 of 5)

Frigid Climate, Industry Can't Stop Some from UIC Seminar

Industry News | 2003-02-07 09:13:12.0

The Sessions Covered Current and Emerging Technologies

SMTnet

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

SMTA Launches On-line SMT Processes Re-Certification

Industry News | 2013-08-07 09:58:46.0

The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.

Surface Mount Technology Association (SMTA)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

Minimum Thickness PCB

Industry News | 2018-10-18 10:56:54.0

Minimum Thickness PCB

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Explore and Qualify for Lead-Free Assembly!

Industry News | 2004-02-04 16:52:03.0

Prepare for the 2006 European Deadline

Practical Components, Inc.

Bonding Flip Chips on to Flexible Circuit Boards

Industry News | 2011-01-18 13:46:21.0

Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.

Würth Elektronik GmbH & Co. KG

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